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NTB35N15T4G Datasheet, PDF (1/8 Pages) ON Semiconductor – N−Channel Enhancement−Mode D2PAK
NTB35N15
Power MOSFET
37 Amps, 150 Volts
N−Channel Enhancement−Mode D2PAK
Features
• Source−to−Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
• Avalanche Energy Specified
• IDSS and RDS(on) Specified at Elevated Temperature
• Mounting Information Provided for the D2PAK Package
• Pb−Free Packages are Available
Typical Applications
• PWM Motor Controls
• Power Supplies
• Converters
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Source Voltage (RGS = 1.0 MW)
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (tpv10 ms)
Drain Current − Continuous @ TA = 25°C
− Continuous @ TA = 100°C
− Pulsed (Note 2)
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C (Note 1)
Operating and Storage Temperature Range
VDSS
VDGR
VGS
VGSM
ID
ID
IDM
PD
TJ, Tstg
150 Vdc
150 Vdc
Vdc
"20
"40
37 Adc
23
111
178 W
1.43 W/°C
2.0 W
−55 to °C
+150
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 100 Vdc, VGS = 10 Vdc,
IL(pk) = 21.6 A, L = 3.0 mH, RG = 25 W)
EAS
700 mJ
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient
− Junction−to−Ambient (Note 1)
RqJC
RqJA
RqJA
°C/W
0.7
62.5
50
Maximum Lead Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
TL
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using the minimum recommended
pad size, (Cu. Area 0.412 in2).
2. Pulse Test: Pulse Width = 10 ms, Duty Cycle = 2%.
© Semiconductor Components Industries, LLC, 2005
1
August, 2005 − Rev. 5
http://onsemi.com
37 AMPERES, 150 VOLTS
50 mW @ VGS = 10 V
N−Channel
D
G
S
MARKING DIAGRAM
& PIN ASSIGNMENT
4
12
3
D2PAK
CASE 418B
STYLE 2
4
Drain
35N15G
AYWW
12 3
Gate Drain Source
35N15
A
Y
WW
G
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping†
NTB35N15
D2PAK
50 Units/Rail
NTB35N15G
NTB35N15T4
NTB35N15T4G
D2PAK
(Pb−Free)
D2PAK
D2PAK
(Pb−Free)
50 Units/Rail
800 Tape & Reel
800 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NTB35N15/D