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NTB30N20T4G Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET 30 Amps, 200 Volts
NTB30N20
Power MOSFET
30 Amps, 200 Volts
N−Channel Enhancement−Mode D2PAK
Features
• Source−to−Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
• Avalanche Energy Specified
• IDSS and RDS(on) Specified at Elevated Temperature
• Mounting Information Provided for the D2PAK Package
• Pb−Free Packages are Available
Typical Applications
• PWM Motor Controls
• Power Supplies
• Converters
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Source Voltage (RGS = 1.0 MW)
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (tpv10 ms)
Drain Current
− Continuous @ TA 25°C
− Continuous @ TA 100°C
− Pulsed (Note 2)
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C (Note 1)
Operating and Storage Temperature Range
VDSS
VDGR
VGS
VGSM
ID
ID
IDM
PD
PD
TJ, Tstg
200 Vdc
200 Vdc
Vdc
"30
"40
30 Adc
22
90
214 W
1.43 W/°C
2.0 W
−55 to °C
+175
Single Drain−to−Source Avalanche Energy,
Starting TJ = 25°C
(VDD = 100 Vdc, VGS = 10 Vdc,
IL(pk) = 20 A, L = 3.0 mH, RG = 25 W)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient
− Junction−to−Ambient (Note 1)
Maximum Lead Temperature for Soldering
Purposes for 10 seconds
EAS
RqJC
RqJA
RqJA
TL
mJ
450
°C/W
0.7
62.5
50
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using the minimum recommended
pad size, (Cu Area 0.412 in2).
2. Pulse Test: Pulse Width = 10 ms, Duty Cycle = 2%.
© Semiconductor Components Industries, LLC, 2005
1
August, 2005 − Rev. 4
http://onsemi.com
VDSS
200 V
RDS(ON) TYP
68 mW @ VGS = 10 V
ID MAX
30 A
N−Channel
D
G
S
4
12
3
D2PAK
CASE 418B
STYLE 2
MARKING DIAGRAM
& PIN ASSIGNMENT
4
Drain
30N20G
AYWW
12 3
Gate Drain Source
30N20
A
Y
WW
G
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping†
NTB30N20
NTB30N20G
NTB30N20T4
NTB30N20T4G
D2PAK
D2PAK
(Pb−Free)
D2PAK
D2PAK
(Pb−Free)
50 Units/Rail
50 Units/Rail
800 Tape & Reel
800 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NTB30N20/D