NTB30N20 Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET 30 Amps, 200 Volts N−Channel Enhancement−Mode D2PAK

NTB30N20
Power MOSFET
30 Amps, 200 Volts
N−Channel Enhancement−Mode D₂PAK
Features
• Source−to−Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
• Avalanche Energy Specified
• I_DSS and R_DS(on) Specified at Elevated Temperature
• Mounting Information Provided for the D₂PAK Package
Typical Applications
• PWM Motor Controls
• Power Supplies
• Converters
MAXIMUM RATINGS (T_C = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Source Voltage (R_GS = 1.0 MΩ)
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (t_pv10 ms)
Drain Current
− Continuous @ T_A 25°C
− Continuous @ T_A 100°C
− Pulsed (Note 2)
Total Power Dissipation @ T_A = 25°C
Derate above 25°C
Total Power Dissipation @ T_A = 25°C (Note 1)
Operating and Storage Temperature Range
V_DSS
V_DGR
V_GS
V_GSM
I_D
I_D
I_DM
P_D
P_D
T_J, T_stg
200 Vdc
200 Vdc
Vdc
"30
"40
Adc
30
22
90
214 W
1.43 W/°C
2.0
W
−55 to °C
+175
Single Drain−to−Source Avalanche Energy −
Starting T_J = 25°C
(V_DD = 100 Vdc, V_GS = 10 Vdc,
I_L(pk) = 20 A, L = 3.0 mH, R_G = 25 Ω)
E_AS
mJ
450
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient
− Junction−to−Ambient (Note 1)
R_θJC
R_θJA
R_θJA
°C/W
0.7
62.5
50
Maximum Lead Temperature for Soldering
Purposes for 10 seconds
T_L
260 °C
1. When surface mounted to an FR4 board using the minimum recommended
pad size, (Cu Area 0.412 in₂).
2. Pulse Test: Pulse Width = 10 µs, Duty Cycle = 2%.
http://onsemi.com
V_DSS
200 V
R_DS(ON) TYP
68 mΩ @ V_GS = 10 V
I_D MAX
30 A
N−Channel
D
G
S
4
12
3
D²PAK
CASE 418B
STYLE 2
MARKING DIAGRAM
& PIN ASSIGNMENT
4
Drain
NTB30N20
LLYWW
1
Gate
2
Drain
3
Source
NTB30N20
LL
Y
WW
= Device Code
= Location Code
= Year
= Work Week
ORDERING INFORMATION
Device
Package
Shipping^†
NTB30N20
NTB30N20T4
D₂PAK
D₂PAK
50 Units/Rail
800 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
1
April, 2004 − Rev. 3
Publication Order Number:
NTB30N20/D