NTB125N02R Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 125 A, 24 V N-Channel TO-220, D2PAK

NTB125N02R, NTP125N02R
Power MOSFET
125 A, 24 V N−Channel
TO−220, D²PAK
Features
• Planar HD3e Process for Fast Switching Performance
• Body Diode for Low t_rr and Q_rr and Optimized for Synchronous
Operation
• Low C_iss to Minimize Driver Loss
• Optimized Q_gd and R_DS(on) for Shoot−through Protection
• Low Gate Charge
MAXIMUM RATINGS (T_J = 25°C Unless otherwise specified)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance − Junction−to−Case
Total Power Dissipation @ T_C = 25°C
Drain Current −
Continuous @ T_C = 25°C, Chip
Continuous @ T_C = 25°C, Limited by Package
Continuous @ T_A = 25°C, Limited by Wires
Single Pulse (t_p = 10 ms)
Thermal Resistance −
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T_A = 25°C
Drain Current − Continuous @ T_A = 25°C
Thermal Resistance −
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T_A = 25°C
Drain Current − Continuous @ T_A = 25°C
Operating and Storage Temperature Range
V_DSS
V_GS
R_qJC
P_D
I_D
I_D
I_D
I_D
24
±20
1.1
113.6
V_dc
V_dc
°C/W
W
125 A
120.5 A
95
A
250 A
R_qJA
P_D
I_D
46 °C/W
2.72 W
18.6 A
R_qJA
P_D
I_D
T_J, T_stg
63 °C/W
1.98 W
15.9 A
−55 to °C
150
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = 50 V_dc, V_GS = 10 V_dc, I_L = 15.5 A_pk,
L = 1 mH, R_G = 25 W)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from Case for 10 Seconds
E_AS
120 mJ
T_L
260 °C
1. When surface mounted to an FR4 board using 1 inch pad size,
(Cu Area 1.127 in²).
2. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu Area 0.412 in²).
PIN ASSIGNMENT
PIN
FUNCTION
1
Gate
2
Drain
3
Source
4
Drain
http://onsemi.com
125 AMPERES, 24 VOLTS
R_DS(on) = 3.7 mW (Typ)
D
G
S
MARKING
DIAGRAMS
4 ^{TO−220AB}
CASE 221A _125N2R
STYLE 5
YWW
123
4
D²PAK
125N2
CASE 418AA
YWW
2
STYLE 2
13
125N2 = Specific Device Code
Y
= Year
WW = Work Week
ORDERING INFORMATION
Device
NTB125N02R
NTB125N02RT4
NTP125N02R
Package
D²PAK
D²PAK
TO−220AB
Shipping^†
50 Units/Rail
800/Tape & Reel
50 Units/Rail
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2003
1
October, 2003 − Rev. 4
Publication Order Number:
NTB125N02R/D