NSVBAT54HT1G Datasheet, PDF (1/4 Pages) ON Semiconductor – Schottky Barrier Diodes

BAT54HT1G,
NSVBAT54HT1G
Schottky Barrier Diodes
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Miniature surface mount
package is excellent for hand held and portable applications where
space is limited.
Features
 Extremely Fast Switching Speed
 Low Forward Voltage − 0.35 V (Typ) @ I_F = 10 mAdc
 Device Marking: JV
 AEC Qualified and PPAP Capable
 NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS (T_J = 125C unless otherwise noted)
Rating
Symbol Value Unit
Reverse Voltage
V_R
30
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1)
T_A = 25C
Derate above 25C
Forward Current (DC)
Non−Repetitive Peak Forward Current,
t_p < 10 msec
Repetitive Peak Forward Current
Pulse Wave = 1 sec, Duty Cycle = 66%
Thermal Resistance
Junction−to−Ambient
Junction and Storage Temperature Range
1. FR−4 Minimum Pad
Symbol
P_D
I_F
I_FSM
I_FRM
R_qJA
T_J, T_stg
Max
200
1.57
200
Max
600
300
635
−55
to150
Unit
mW
mW/C
mA
mA
mA
C/W
C
http://onsemi.com
30 VOLT SILICON
HOT−CARRIER DETECTOR
AND SWITCHING DIODES
SOD−323
CASE 477
STYLE 1
1
CATHODE
2
ANODE
MARKING DIAGRAM
JVM G
1
G
2
JV
= Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
BAT54HT1G
NSVBAT54HT1G
Package
SOD−323
(Pb−Free)
SOD−323
(Pb−Free)
Shipping^†
3,000 /
Tape & Reel
3,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2011
1
November, 2011 − Rev. 6
Publication Order Number:
BAT54HT1/D