NSRLL30XV2T1G_17 Datasheet, PDF (1/3 Pages) ON Semiconductor – Schottky Barrier Diode

NSRLL30XV2T1G
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
Features
• Extremely Fast Switching Speed
• Extremely Low Forward Voltage 0.6 V (max) @ I_F = 200 mA
• Low Reverse Current
• ESD Rating: Class 3B per Human Body Model
Class C per Machine Model
• This is a Pb−Free Device
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Reverse Voltage
V_R
30
V
Forward Current DC
I_F
200
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1) T_A = 25°C
Derate above 25°C
Symbol
P_D
Max
200
1.57
Unit
mW
mW/°C
Non−Repetitive Peak Forward
Current, t_p < 10 msec
I_FSM
600
mA
Repetitive Peak Forward Current
I_FRM
300
mA
Pulse Wave = 1 sec, Duty Cycle = 66%
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
1. FR−5 Minimum Pad.
R_qJA
T_J, T_stg
635
−55 to +150
°C/W
°C
ELECTRICAL CHARACTERISTICS (T_A = 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
Reverse Leakage
(V_R = 10 V)
I_R
− − 1.0 mA
Forward Voltage
(I_F = 200 mA)
V_F
− − 0.60 V
www.onsemi.com
30 VOLT SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
2
1
SOD−523
CASE 502
MARKING DIAGRAM
RT M G
G
1
2
RT = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation position may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
NSRLL30XV2T1G SOD−523 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2017
1
February, 2017 − Rev. 3
Publication Order Number:
NSRLL30XV2/D