NSR02F30NXT5G Datasheet, PDF (1/4 Pages) ON Semiconductor – Schottky Barrier Diode

NSR02F30NXT5G
Schottky Barrier Diode
These Schottky barrier diodes are optimized for low forward
voltage drop and low leakage current. The DSN2 (Dual Silicon
No−lead) package is a chip level package using solderable metal
contacts under the package similar to DFN style packages. The DSN
style package enables 100% utilization of the package area for active
silicon, offering a significant performance per board area advantage
compared to products in plastic molded packages. The low thermal
resistance enables designers to meet the challenging task of achieving
higher efficiency and meeting reduced space requirements.
Features
• Very Low Forward Voltage Drop − 370 mV @ 10 mA
• Low Reverse Current − 7.0 mA @ 10 V VR
• 200 mA of Continuous Forward Current
• ESD Rating − Human Body Model: Class 3B
ESD Rating − Machine Model: Class C
• Very High Switching Speed
• Low Capacitance − CT = 7 pF
• This is a Halide−Free Device
• This is a Pb−Free Device
Typical Applications
• LCD and Keypad Backlighting
• Camera Photo Flash
• Buck and Boost dc−dc Converters
• Reverse Voltage and Current Protection
• Clamping & Protection
Markets
• Mobile Handsets
• MP3 Players
• Digital Camera and Camcorders
• Notebook PCs & PDAs
• GPS
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Reverse Voltage
V_R
30
V
Forward Current (DC)
I_F
200
mA
Forward Surge Current
I_FSM
A
(60 Hz @ 1 cycle)
4.0
ESD Rating:
Human Body Model
ESD
8.0
kV
Machine Model
400
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
30 V SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
DSN2
(0201)
CASE 152AA
MARKING
DIAGRAM
PIN 1
XXXX
YYY
XXXX = Specific Device Code
YYY = Year Code
ORDERING INFORMATION
Device
Package
Shipping†
NSR02F30NXT5G DSN2 5000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
1
June, 2009 − Rev. 0
Publication Order Number:
NSR02F30/D