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NSM21356DW6T1G Datasheet, PDF (1/4 Pages) ON Semiconductor – Dual Complementary Transistors
NSM21356DW6T1G
Dual Complementary
Transistors
General Purpose PNP Transistor and
NPN Transistors with Monolithic Bias
Network
NSM21356DW6T1G contains a single PNP transistor and a
monolithic bias network NPN transistor with two resistors; a series
base resistor and a base-emitter resistor. This device is designed to
replace multiple transistors and resistors on customer boards by
integrating these components into a single device.
NSM21356DW6T1G is housed in a SC-88/SOT-363 package which
is ideal for low power surface mount applications in space constrained
applications.
Features
•ăSimplifies Circuit Design
•ăReduces Board Space
•ăReduces Component Count
•ăQ1: NPN BRT, R1 = R2 = 47 k
•ăQ2: PNP
•ăThis is a Pb-Free Device
Applications
•ăLogic Switching
•ăAmplification
•ăDriver Circuits
•ăInterface Circuits
MAXIMUM RATINGS
(TA = 25°C unless otherwise noted)
Rating - Q1 (NPN BRT)
Collector‐Base Voltage
Collector‐Emitter Voltage
Collector Current
Rating - Q2 (PNP)
Symbol
VCBO
VCEO
IC
Symbol
Value
ā50
ā50
100
Value
Unit
Vdc
Vdc
mAdc
Unit
Collector - Base Voltage
V(BR)CBO
-ā80
Vdc
Collector - Emitter Voltage
V(BR)CEO
-ā65
Vdc
Emitter - Base Voltage
V(BR)EBO
-ā5.0
Vdc
Collector Current - Continuous
IC
-100
mAdc
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
(3)
(2)
(1)
Q1
Q2
R2
R1
(4)
(5)
(6)
6
1
SC-88/SOT-363
CASE 419B
STYLE 1
MARKING DIAGRAM
6
N2 M G
G
1
N2
= Device Code
M
= Date Code*
G
= Pb-Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
NSM21356DW6T1G SC-88 3000/Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2008
1
March, 2008 - Rev. 0
Publication Order Number:
NSM21356DW6/D