NRVBA2H100T3G Datasheet, PDF (1/7 Pages) ON Semiconductor – Surface Mount Schottky Power Rectifier SMA/SMB Power Surface Mount Package

MBRS2H100T3G,
NBRS2H100T3G,
MBRA2H100T3G,
NRVBA2H100T3G,
Surface Mount
Schottky Power Rectifier
SMA/SMB Power Surface Mount Package
This device employs the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
Features
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guard−Ring for Overvoltage Protection
• Low Forward Voltage Drop
• NBR and NRVB Prefixes for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements;
AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant*
Mechanical Characteristics
• Case: Molded Epoxy
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 70 mg (SMA), 95 mg (SMB) (Approximately)
• Cathode Polarity Band
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• ESD Ratings:
♦ Machine Model = C
♦ Human Body Model = 3B
• Device Meets MSL1 Requirements
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES, 100 VOLTS
MARKING
DIAGRAMS
SMA
CASE 403D
A210
AYWWG
SMB
CASE 403A
AYWW
B210G
G
A210
B210
A
Y
WW
G
= MBRA2H100T3G
NRVBA2H100T3G
= MBRS2H100T3G
NBRS2H100T3G
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
MBRA2H100T3G
SMA
(Pb−Free)
NRVBA2H100T3G SMA
(Pb−Free)
Shipping^†
5,000 /
Tape & Reel
5,000 /
Tape & Reel
MBRS2H100T3G
NBRS2H100T3G
SMB
(Pb−Free)
SMB
(Pb−Free)
2,500 /
Tape & Reel
2,500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2012
1
December, 2012 − Rev. 8
Publication Order Number:
MBRS2H100/D