NMF3506 Datasheet, PDF (1/6 Pages) ON Semiconductor – Mini Buck Converter for RF Power Amplifiers

NMF3506
Advance Information
RF Filtering and ESD
Protection on I²C Bus
and Digital Line, Thermal
Shutdown and Power
Switch with Short Circuit
Protection
The NMF3506 interfaces with mobile phone accessories using I²C
bus. It includes two I²C line filters and a general purpose digital line
filter. It is compliant with EMC international standards required for
cellular phones and portable equipment. It also includes a low voltage
drop power switch to control the accessory supply. It has safety
features such as thermal shutdown and main switch short circuit
protection. All I/O are ESD protected according to the stringent
IEC 61000−4−2 international standard.
Features
• ESD Protection IEC 61000−4−2 Level 4 (Vbatt and Output Pins)
• ESD Protection IEC 61000−4−2 Level 1 (All I/O)
• RF Filtering (800 MHz–6.0 GHz): −25 dB
• RF Filtering (1.0 GHz–2.5 GHz): −30 dB
• Power Switch: 120 mA (<200 mV)
• Voltage Drop Across Power Switch: <200 mV
• Controlled I²C Bias
• Low Quiescent Current, 10 mA_off, 100 mA_on
• 15 Bump Flip−Chip Direct Chip Attach:
2.1 mm x 2.1 mm x 0.65 mm
• This is a Pb−Free Device
Typical Application
• Cellular Phones
• Portable Equipment
http://onsemi.com
MARKING
DIAGRAM
ÇÇ^A1
FLIP−CHIP 15 CSP
CASE TBD
xx
xx
A1
LYW
xx = Specific Device Code
L = Wafer Lot
Y = Year
W = Work Week
ORDERING INFORMATION
Device
Package
Shipping^†
NMF3506FCT1G Flip−Chip 3000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
© Semiconductor Components Industries, LLC, 2004
1
March, 2004 − Rev. P0
Publication Order Number:
NMF3506/D