NLSV4T3234 Datasheet, PDF (1/7 Pages) ON Semiconductor – 4−Bit Dual−Supply Bus Buffer Level Translator with 26 ohm Output Series Resistor

NLSV4T3234
4−Bit Dual−Supply Bus
Buffer Level Translator with
26 W Output Series Resistor
The NLSV4T3234 is a 4−bit configurable dual−supply voltage level
translator. The input (B−) and output (A−) ports are designed to track
two different power supply rails, V_CCB and V_CCA respectively. Both
supply rails are configurable from 0.9 V to 4.5 V, allowing
high−to−low and low−to high voltage translation from the input (B−)
to the output (A−) port.
The NLSV4T3234 is a low power voltage translator that contains
series output resistors, and overvoltage tolerant (OVT) input and
output protection. The 26 W series resistor on the output drivers
minimizes ringing on the logic transition edges. The OVT feature
allows the NLSV4T3234 to translate input signals greater than the
input power supply V_CCB and protects the IC from damage if a signal
is connected to an output pin that is greater than V_CCA.
Features
• Wide V_CCA and V_CCB Operating Range: 0.9 V to 4.5 V
• High−Speed Logic Voltage Translation
• 26 W Series Resistors on Outputs (A−) Reduce Ground Bounce and
Overshoot
• Overvoltage Tolerant (OVT) Inputs and Outputs to 4.5 V
• Non−preferential Power Supply Sequencing
• Outputs At 3−State Until Active V_CC Is Reached
• Outputs Switch to 3−State with V_CCA at GND
• Ultra−Small Packaging: 1.41 mm x 2.04 mm Flip−Chip11
• RoHS Compliant
• This is a Pb−Free Device*
Typical Applications
• Mobile Phones, PDAs, Other Portable Devices
V_CCB
B1
B2
V_CCA
26 W
A1
26 W
A2
26 W
B3
A3
26 W
B4
A4
Figure 1. Logic Diagram
http://onsemi.com
MARKING
DIAGRAM
11 PIN FLIP−CHIP
FC SUFFIX
A1
CASE 766AJ
4T3234
AYWW
G
4T3234 = Specific Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
PIN ASSIGNMENT
C
B
A
B4
A4
1
GND
2
B3
A3
3
V_CCB
4
B2
A2
5
V_CCA
6
B1
A1
7
(Top View)
ORDERING INFORMATION
Device
Package
Shipping^†
NLSV4T3234FCT1G Flip−Chip11
3000/
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy
and soldering details, please download the ON
Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2007
1
March, 2007 − Rev. 0
Publication Order Number:
NLSV4T3234/D