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NDF06N60ZH Datasheet, PDF (1/8 Pages) ON Semiconductor – N-Channel Power MOSFET 600 V, 1.2 
NDF06N60Z
N-Channel Power MOSFET
600 V, 1.2 W
Features
• Low ON Resistance
• Low Gate Charge
• ESD Diode−Protected Gate
• 100% Avalanche Tested
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
ABSOLUTE MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Continuous Drain Current, RqJC (Note 1)
Continuous Drain Current
TA = 100°C, RqJC (Note 1)
VDSS
600
V
ID
7.1
A
ID
4.5
A
Pulsed Drain Current,
VGS @ 10 V
IDM
28
A
Power Dissipation, RqJC
PD
Gate−to−Source Voltage
VGS
Single Pulse Avalanche Energy, L = 6.3 mH, EAS
ID = 6.0 A
35
W
±30
V
113
mJ
ESD (HBM) (JESD22−A114)
RMS Isolation Voltage
(t = 0.3 sec., R.H. ≤ 30%,
TA = 25°C) (Figure 13)
Peak Diode Recovery (Note 2)
Vesd
3000
V
VISO
4500
V
dv/dt
4.5 V/ns
Continuous Source Current (Body Diode)
IS
6.0
A
Maximum Temperature for Soldering Leads
TL
260
°C
Operating Junction and
Storage Temperature Range
TJ, Tstg − 55 to °C
150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Limited by maximum junction temperature
2. ISD = 6.0 A, di/dt ≤ 100 A/ms, VDD ≤ BVDSS, TJ = +150°C
http://onsemi.com
VDSS (@ TJmax)
650 V
RDS(ON) (MAX) @ 3 A
1.2 Ω
N−Channel
D (2)
G (1)
S (3)
1
2
3
NDF06N60ZG
TO−220FP
CASE 221D
1
2
3
NDF06N60ZH
TO−220FP
CASE 221AH
ORDERING AND MARKING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
1
February, 2013 − Rev. 6
Publication Order Number:
NDF06N60Z/D