NDD03N40Z Datasheet, PDF (1/9 Pages) ON Semiconductor – N-Channel Power MOSFET

NDD03N40Z, NDT03N40Z
N-Channel Power MOSFET
400 V, 3.4 W
Features
• 100% Avalanche Tested
• Extremely High dv/dt Capability
• Gate Charge Minimized
• Very Low Intrinsic Capacitance
• Improved Diode Reverse Recovery Characteristics
• Zener−protected
• These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS
Compliant
ABSOLUTE MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol NDD NDT Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain Current
Steady State, T_C = 25°C (Note 1)
Continuous Drain Current
Steady State, T_C = 100°C (Note 1)
Power Dissipation
Steady State, T_C = 25°C
Pulsed Drain Current
Continuous Source Current (Body
Diode)
V_DSS
V_GS
I_D
I_D
P_D
I_DM
I_S
400
V
±30
V
2.1 0.5 A
1.3 0.3 A
37 2.0 W
8.0 7.2 A
2.1 0.5 A
Single Pulse Drain−to−Source
Avalanche Energy (I_D = 1 A)
Peak Diode Recovery (Note 2)
EAS
dV/dt
42
mJ
12
V/ns
Maximum Temperature for Soldering
T_L
Leads
260
°C
Operating Junction and Storage
Temperature
T_J, T_STG −55 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Limited by maximum junction temperature
2. I_S ≤ 2.4 A, di/dt ≤ 400 A/ms, V_DD ≤ BV_DSS, T_J = +150°C
THERMAL RESISTANCE
Parameter
Symbol Value Unit
Junction−to−Case (Drain)
NDD03N40Z R_qJC
3.4 °C/W
Junction−to−Ambient Steady State
NDD03N40Z (Note 4)
NDD03N40Z−1 (Note 3)
NDT03N40Z (Note 4)
NDT03N40Z (Note 5)
R_qJA
°C/W
42
96
62
149
3. Insertion mounted
4. Surface mounted on FR4 board using 1″ sq. pad size
(Cu area = 1.127″ sq. [2 oz] including traces)
5. Surface−mounted on FR4 board using minimum recommended pad size
(Cu area = 0.026” sq. [2 oz]).
http://onsemi.com
V_(BR)DSS
400 V
R_DS(ON) MAX
3.4 W @ 10 V
N−Channel
D (2, 4)
G (1)
S (3)
4
1 ₂₃
SOT−223
CASE 318E
STYLE 3
4
4
12
3
DPAK
CASE 369C
STYLE 2
1 ₂₃
IPAK
CASE 369D
STYLE 2
MARKING & ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
May, 2014 − Rev. 1
Publication Order Number:
NDD03N40Z/D