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NCV7703 Datasheet, PDF (1/16 Pages) ON Semiconductor – Triple Half-Bridge Driver with SPI Control | |||
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NCV7703
Triple Half-Bridge Driver
with SPI Control
The NCV7703 is a fully protected Triple HalfâBridge Driver
designed specifically for automotive and industrial motion control
applications. The three halfâbridge drivers have independent control.
This allows for high side, low side, and HâBridge control. HâBridge
control provides forward, reverse, brake, and high impedance states.
The drivers are controlled via a standard SPI (Serial Peripheral
Interface). This device is fully compatible with ON Semiconductorâs
NCV7708 Double Hex Driver.
Features
⢠Ultra Low Quiescent Current in Sleep Mode, 1 mA for VS and VCC
⢠Power Supply Voltage Operation down to 5 V
⢠3 HighâSide and 3 LowâSide Drivers Connected as HalfâBridges
⢠Internal FreeâWheeling Diodes
⢠Configurable as HâBridge Drivers
⢠0.5 A Continuous (1 A peak) Current
⢠RDS(on) = 0.8 W (typ)
⢠5 MHz SPI Control with Daisy Chain Capability
⢠Compliance with 5 V and 3.3 V Systems
⢠Overvoltage and Undervoltage Lockout
⢠Fault Reporting
⢠1.4 A Overcurrent Threshold Detection with Optional Shutdown
⢠3 A Current Limit with Auto Shutdown
⢠Overtemperature Warning and Protection Levels
⢠Internally Fused Leads in SOICâ14 Package for Better Thermal
Performance
⢠ESD Protection up to 6 kV
⢠This is a PbâFree Device
Typical Applications
⢠Automotive
⢠Industrial
⢠DC Motor Management
VS
VS
VS
M
OUT1
M
OUT2
OUT3
http://onsemi.com
14
1
SOICâ14
D2 SUFFIX
CASE 751A
MARKING DIAGRAM
14
NCV7703G
AWLYWW
1
NCV7703 = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
Y
= Year
WW = Work Week
G
= PbâFree Package
PIN CONNECTIONS
GND
OUT3
VS
CSB
SI
SCLK
GND
GND
OUT1
OUT2
VCC
EN
SO
GND
ORDERING INFORMATION
Device
Package
Shippingâ
NCV7703D2G
SOICâ14
(PbâFree)
55 Units / Rail
NCV7703D2R2G SOICâ14 2500 / Tape & Reel
(PbâFree)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Figure 1. Cascaded Application
© Semiconductor Components Industries, LLC, 2008
1
September, 2008 â Rev. 2
Publication Order Number:
NCV7703/D
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