NCV7429 Datasheet, PDF (1/43 Pages) ON Semiconductor – System Basis Chip

NCV7429
System Basis Chip with
LIN, LS and HS Switches
Description
The NCV7429 is a monolithic LIN System-Basis-Chip with
enhanced feature set useful in Automotive Body Control systems.
Besides the LIN bus interface the IC features a 5 V voltage regulator,
high-side and low-side switches to control LEDs and relays, and
supervision functionality like a window watchdog. This allows
a highly integrated solution by replacing external discrete components
while maintaining the system flexibility. As a consequence, the board
space and ECU weight can be minimized.
Features
• Main Supply Functional Operating Range from 5 V to 28 V
• Main Supply Parametrical Operating Range 6 V to 18 V
• LIN Physical Layer According to ISO 17987−4 (backwards
compatible to LIN 1.3, LIN 2.x) and SAE J2602
• Power Management Through Operating Modes: Normal, Standby,
Sleep and Flash
• Software Development Mode for Software Debugging
• Low Drop Voltage Regulator VR1: 5 V/150 mA, 2%
• One Wake-up Input, e.g. for Contact Monitoring
• Wake-up Logic with Cyclic Contact Monitoring
• Wake-up Source Recognition
• Independent PWM Functionality for All Outputs
(Integrated PWM Registers)
• Window Watchdog with Programmable Times
• 2x Low-side Driver (typ. 1.5 W) with Over-load Protection
and Active Clamp; e.g. for Relays
• 3x High-side Driver (typ. 5 W) with Over- and Under-load Detection;
e.g. for LED’s and Switches
• 24-bit SPI Interface
• Protection against Short Circuit, Over-voltage and Over-temperature
• TSSOP−20 EP Package
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These Devices are Pb-Free, Halogen Free/BFR Free and are
RoHS Compliant
Typical Applications
• De-centralized Door Electronic Systems
www.onsemi.com
TSSOP−20 EP
CASE 948AB
MARKING DIAGRAM
NV74
29−5
ALYWG
G
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb-Free Package
(Note: Microdot may be in either location)
GND1
SWDM
NRES
VR1
TxDL
RxDL/INTN
SDI
SDO
SCLK
CSN
PIN ASSIGNMENT
1
20
NCV7429
LS2
LS1
GND2
LIN
VS
VS_OUT
OUT1
OUT2
OUT3/FSO
WU
(Top View)
ORDERING INFORMATION
Device
Package
Shipping^†
NCV7429DE5R2G TSSOP−20 2500 / Tape &
(Pb-Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2017
1
March, 2017 − Rev. 0
Publication Order Number:
NCV7429/D