NCV7381 Datasheet, PDF (1/23 Pages) ON Semiconductor – FlexRay Bus Driver

NCV7381
FlexRay⁾ Bus Driver
NCV7381 is a single−channel FlexRay bus driver compliant with
the FlexRay Electrical Physical Layer Specification Rev. 3.0.1,
capable of communicating at speeds of up to 10 Mbit/s. It provides
differential transmit and receive capability between a wired FlexRay
communication medium on one side and a protocol controller and
a host on the other side.
NCV7381 mode control functionality is optimized for nodes
permanently connected to car battery.
It offers excellent EMC and ESD performance.
KEY FEATURES
General
• Compliant with FlexRay Electrical Physical Layer Specification
Rev 3.0.1
• FlexRay Transmitter and Receiver in Normal−power Modes for
Communication up to 10 Mbit/s
• Support of 60 ns Bit Time
• FlexRay Low−power Mode Receiver for Remote Wakeup Detection
• Excellent Electromagnetic Susceptibility (EMS) Level over Full
Frequency Range. Very Low Electromagnetic Emissions (EME)
• Bus Pins Protected against >10 kV System ESD Pulses
• Safe Behavior under Missing Supply or No Supply Conditions
• Interface Pins for a Protocol Controller and a Host
(TxD, RxD, TxEN, RxEN, STBN, BGE, EN, ERRN)
• INH Output for Control of External Regulators
• Local Wakeup Pin WAKE
• TxEN Time−out
• BGE Feedback
• Supply Pins V_BAT, V_CC, V_IO with Independent Voltage Ramp Up:
♦ V_BAT Supply Parametrical Range from 5.5 V to 50 V
♦ V_CC Supply Parametrical Range from 4.75 V to 5.25 V
♦ V_IO Supply Parametrical Range from 2.3 V to 5.25 V
• Compatible with 14 V and 28 V Systems
• Operating Ambient Temperature −40°C to +125°C (T_{AMB_Class1})
• Junction Temperature Monitoring with Two Levels
• SSOP−16 Package
FlexRay Functional Classes
• Bus Driver Voltage Regulator Control
• Bus Driver – Bus Guardian Interface
• Bus Driver Logic Level Adaptation
• Bus Driver Remote Wakeup
Quality
• Automotive Qualification According to AEC−Q100 (Rev. F)
http://onsemi.com
SSOP−16
DP SUFFIX
CASE 565AE
MARKING DIAGRAM
16
NV7381−0
AWLYYWW
G
1
A = Assembly Location
WL = Wafer Lot
YYWW = Year / Work Week
G = Pb−Free Package
INH
EN
V_IO
TxD
TxEN
RxD
BGE
STBN
PIN CONNECTIONS
1
V_CC
BP
BM
GND
WAKE
V_BAT
ERRN
RxEN
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 23 of this data sheet.
© Semiconductor Components Industries, LLC, 2012
1
May, 2012 − Rev. 0
Publication Order Number:
NCV7381/D