NCV7341 Datasheet, PDF (1/18 Pages) ON Semiconductor – High Speed Low Power CAN Transceiver

NCV7341
High Speed Low Power CAN
Transceiver
The NCV7341 CAN transceiver is the interface between a
controller area network (CAN) protocol controller and the physical
bus and may be used in both 12 V and 24 V systems. The transceiver
provides differential transmit capability to the bus and differential
receive capability to the CAN controller.
Due to the wide common−mode voltage range of the receiver inputs,
the NCV7341 is able to reach outstanding levels of electromagnetic
susceptibility (EMS). Similarly, extremely low electromagnetic
emission (EME) is achieved by the excellent matching of the output
signals.
The NCV7341 is a new addition to the ON Semiconductor CAN
high−speed transceiver family and offers the following additional
features:
Features
• Ideal Passive Behavior when Supply Voltage is Removed
• Separate V_IO Supply for Digital Interface Allowing Communication
to CAN Controllers and Microcontrollers with Different Supply
Levels
• Fully Compatible with the ISO 11898 Standard
• High Speed (up to 1 Mb)
• Very Low Electromagnetic Emission (EME)
• V_SPLIT Voltage Source for Stabilizing the Recessive Bus Level if
Split Termination is Used (Further Improvement of EME)
• Differential Receiver with High Common−Mode Range for
Electromagnetic Immunity (EMI)
• Up to 110 Nodes can be Connected in Function of the Bus Topology
• Transmit Data (TxD) Dominant Time−out Function
• Bus Pins Protected Against Transients in Automotive Environments
• Bus Pins and Pin V_SPLIT Short−Circuit Proof to Battery and Ground
• Thermally Protected
• NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
• These are Pb−Free Devices*
Typical Applications
• Automotive
• Industrial Networks
http://onsemi.com
PIN ASSIGNMENT
TxD 1
GND 2
V_CC
3
RxD 4
V_IO
5
EN ⁶
INH 7
14
STB
13 CANH
12 _CANL
11
V_SPLIT
10 _VBAT
9
WAKE
8
ERR
(Top View) PC20060727.1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 17 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2008
1
November, 2008 − Rev. 3
Publication Order Number:
NCV7341/D