NCV70501 Datasheet, PDF (1/22 Pages) ON Semiconductor – Micro-Stepping Motor Driver

NCV70501
Micro-Stepping Motor
Driver
Introduction
NCV70501 is a micro−stepping stepper motor driver for bipolar
stepper motors. The chip is connected through I/O pins and an SPI
interface with an external microcontroller. The NCV70501 contains a
current−translation table and takes the next micro−step depending on
the clock signal on the “NXT” input pin and the status of the “DIR” (=
direction) register or input pin. The chip provides an error message if
stall, an electrical error or an elevated junction temperature is detected.
It is using a proprietary PWM algorithm for reliable current control.
NCV70501 is fully compatible with the automotive voltage
requirements and is ideally suited for general−purpose low current
range stepper motor applications in the automotive, industrial,
medical, and marine environment.
Features
• Dual H−Bridge for 2−Phase Stepper Motors
• Programmable Peak−Current Up to 300 mA
• On−Chip Current Translator
• SPI Interface With Daisy Chain Capability
• 6 Step Modes from Full−Step up to 16 Micro−Steps
• Fully Integrated Current−Sensing and Current−Regulation
• On Chip Stall Detection
• PWM Current Control with Automatic Selection of Fast and Slow
Decay
• Fixed PWM Frequency
• Active Fly−Back Diodes
• Full Output Protection and Diagnosis
• Thermal (Warning and) Shutdown
• Compatible with 3.3 V Microcontrollers, 5 V Tolerant Inputs, 5 V
Tolerant Open Drain Outputs
• Reset Function
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
http://onsemi.com
MARKING
DIAGRAM
SOIC−16
CASE 751B
NCV70501−2G
AWLYWW
A
= Assembly Location
WL = Wafer Lot
Y
= Year
WW = Work Week
G
= Pb−Free Package
PINOUT
DO 1
CSB 2
DI ³
GND 4
CLK 5
NXT 6
DIR 7
ERRB 8
16 TST
15 MOTXP
14 MOTXN
13 GND
12 VBB
11 _MOTYP
10 _MOTYN
9 ^RHB
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
1
March, 2013 − Rev. 2
Publication Order Number:
NCV70501/D