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NCP81382 Datasheet, PDF (1/16 Pages) ON Semiconductor – Integrated Driver and MOSFET | |||
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NCP81382
Integrated Driver
and MOSFET
The NCP81382 integrates a MOSFET driver, highâside MOSFET
and lowâside MOSFET into a single package.
The driver and MOSFETs have been optimized for highâcurrent
DCâDC buck power conversion applications. The NCP81382
integrated solution greatly reduces package parasitics and board space
compared to a discrete component solution.
Features
⢠Capable of Average Currents up to 35 A
⢠Capable of Switching at Frequencies up to 2 MHz
⢠Capable of Peak Currents up to 70 A
⢠Compatible with 3.3 V or 5 V PWM Input
⢠Responds Properly to 3âlevel PWM Inputs
⢠Option for Zero Cross Detection with 3âlevel PWM
⢠ZCD_EN Input for Diode Emulation with 2âlevel PWM
⢠Internal Bootstrap Diode
⢠Undervoltage Lockout
⢠Supports Intel® Power State 4
⢠Thermal Warning output
⢠Thermal Shutdown
⢠This is a PbâFree Device
Applications
⢠Desktop & Notebook Microprocessors
5V
VIN
Zero Current
Detect Enable
DRVON from controller
PWM from controller
SMOD from controller
VCCD VCC
ZCD_EN
VIN
THWN
BOOT
DISB#
PWM
SMOD#
CGND
PHASED
PHASEF
VSW
PGND
Figure 1. Application Schematic
VOUT
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MARKING
DIAGRAM
1 36
QFN36 6x4
CASE 485DZ
81382
ALYWG
G
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = PbâFree Package
(Note: Microdot may be in either location)
PINOUT DIAGRAM
VCCD 7
GL 8
GL 9
GL 10
GL 11
VSW 12
VSW 13
VSW 14
VSW 15
VSW 16
VSW 17
VSW 18
38
TEST
37
PGND
36 ZCD_EN
35 BOOT
34 PHASED
33 GH
32 PHASEF
31 PGND
30 VIN
29 VIN
28 VIN
27 VIN
26 VIN
25 VIN
(Top View)
ORDERING INFORMATION
Device
NCP81382MNTXG
Package
QFN36
(PbâFree)
Shippingâ
2500 / Tape &
Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
1
February, 2016 â Rev. 2
Publication Order Number:
NCP81382/D
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