NCP81381 Datasheet, PDF (1/16 Pages) ON Semiconductor – Integrated Driver and MOSFET

NCP81381
Integrated Driver
and MOSFET
The NCP81381 integrates a MOSFET driver, high−side MOSFET
and low−side MOSFET into a single package.
The driver and MOSFETs have been optimized for high−current
DC−DC buck power conversion applications. The NCP81381
integrated solution greatly reduces package parasitics and board space
compared to a discrete component solution.
Features
• Capable of Average Currents up to 25 A
• Capable of Switching at Frequencies up to 2 MHz
• Capable of Peak Currents up to 60 A
• Compatible with 3.3 V or 5 V PWM Input
• Responds Properly to 3−level PWM Inputs
• Option for Zero Cross Detection with 3−level PWM
• ZCD_EN Input for Diode Emulation with 2−level PWM
• Internal Bootstrap Diode
• Undervoltage Lockout
• Supports Intel^® Power State 4
• Thermal Warning output
• Thermal Shutdown
• This is a Pb−Free Device
Applications
• Desktop & Notebook Microprocessors
5V
VIN
Zero Current
Detect Enable
DRVON from controller
PWM from controller
SMOD from controller
VCCD VCC
ZCD_EN
VIN
THWN
BOOT
DISB#
PWM
SMOD#
CGND
PHASED
PHASEF
VSW
PGND
Figure 1. Application Schematic
VOUT
www.onsemi.com
MARKING
DIAGRAM
1 36
QFN36 6x4
CASE 485DZ
81381
ALYWG
G
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
PINOUT DIAGRAM
VCCD ⁷
GL ⁸
GL ⁹
GL ¹⁰
GL ¹¹
VSW ¹²
VSW ¹³
VSW ¹⁴
VSW ¹⁵
VSW ¹⁶
VSW ¹⁷
VSW ¹⁸
38
TEST
37
PGND
36 _{ZCD_EN}
35 _BOOT
34 _PHASED
33 _GH
32 _PHASEF
31 _PGND
30 _VIN
29 _VIN
28 _VIN
27 _VIN
26 _VIN
25 _VIN
(Top View)
ORDERING INFORMATION
Device
NCP81381MNTXG
Package
QFN36
(Pb−Free)
Shipping^†
2500 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
1
November, 2015 − Rev. 1
Publication Order Number:
NCP81381/D