NCP81230H Datasheet, PDF (1/12 Pages) ON Semiconductor – Precise Low Voltage Synchronous Buck Controller

NCP81230H
Product Preview
Precise Low Voltage
Synchronous Buck
Controller with Power
Saving Mode
http://onsemi.com
The NCP81230H is a simple single phase solution with differential
phase current sensing, power saving operation, and gate drivers to
provide accurately regulated power.
The adaptive non overlap gate drive and power saving operation
circuit provide a low switching loss and high efficiency solution for
server, notebook, and desktop systems. A high performance
operational error amplifier is provided to simplify compensation of the
system. The NCP81230H features also include soft−start sequence,
accurate overvoltage and over current protection, UVLO for VCC and
VCCP, and thermal shutdown.
Features
• High Performance Operational Error Amplifier
• Internal Soft−Start/Stop
• ±0.5% Internal Voltage Accuracy, 0.8 V voltage reference
• OCP accuracy, Four Re−entry Times Before Latch
• “Lossless” Differential Inductor Current Sensing
• Internal High Precision Current Sensing Amplifier
• Oscillator Frequency Range of 100 kHz − 1000 kHz
• 20 ns Adaptive FET Non−overlap Time of Internal Gate Driver
• 5.0 V to 12 V Operation
• Support 1.5 V to 19 V V_in
• V_out from 0.8 V to 3.3 V (5 V with 12 V_CC)
• Chip Enable through OSC pin
• Latched Over Voltage Protection (OVP)
• Internally Fixed OCP Threshold
• Guaranteed Startup Into Pre−Charged Loads
• Thermally Compensated Current Monitoring
• Thermal Shutdown Protection
• Integrated MOSFET Drivers
• Integrated BOOST Diode with internal R_bst = 2.2 W
• Automatic Power Saving Mode to Maximize Efficiency During Light
Load Operation
• Sync Function
• Remote Ground Sensing
• This is a Pb−Free Device
Applications
• Desktop and Server Systems
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
MARKING
DIAGRAMS
QFN16
XXXX
CASE 485G
ALYWG
1
G
XXXX
A
L
Y
W
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(*Note: Microdot may be in either location)
PIN CONNECTIONS
16 15 14 13
VCCP ¹
LG 2
LX 3
BOOT 4
12 _CSN/VO
11 FBG
10 VSEN
9 FB
5
6
7
8
(Top View)
ORDERING INFORMATION
Device
Package
Shipping
NCP81230HMNTWG QFN16 3000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
September, 2014 − Rev. P1
Publication Order Number:
NCP81230H/D