NCP81071 Datasheet, PDF (1/14 Pages) ON Semiconductor – Dual 5 A High Speed Low-Side MOSFET Drivers

NCP81071
Dual 5 A High Speed
Low-Side MOSFET Drivers
with Enable
NCP81071 is a high speed dual low−side MOSFETs driver. It is
capable of providing large peak currents into capacitive loads. This
driver can deliver 5 A peak current at the Miller plateau region to help
reduce the Miller effect during MOSFETs switching transition. This
driver also provides enable functions to give users better control
capability in different applications. ENA and ENB are implemented
on pin 1 and pin 8 which were previously unused in the industry
standard pin−out. They are internally pulled up to driver’s input
voltage for active high logic and can be left open for standard
operations. This part is available in MSOP8−EP package, SOIC8
package and WDFN8 3 mm x 3 mm package.
Features
• High Current Drive Capability ±5 A
• TTL/CMOS Compatible Inputs Independent of Supply Voltage
• Industry Standard Pin−out
• High Reverse Current Capability (6 A) Peak
• Enable Functions for Each Driver
• 8 ns Typical Rise and 8 ns Typical Fall Times with 1.8 nF Load
• Typical Propagation Delay Times of 20 ns with Input Falling and
20 ns with Input Rising
• Input Voltage from 4.5 V to 20 V
• Dual Outputs can be Paralleled for Higher Drive Current
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Server Power
• Telecommunication, Datacenter Power
• Synchronous Rectifier
• Switch Mode Power Supply
• DC/DC Converter
• Power Factor Correction
• Motor Drive
• Renewable Energy, Solar Inverter
www.onsemi.com
SOIC−8
D SUFFIX
CASE 751
MARKING
DIAGRAMS
8
XXXX
ALYW
G
1
MSOP−8
Z SUFFIX
CASE 846AM
XXXX
AYW
G
1
WDFN8
MN SUFFIX
CASE 511CD
1
XX MG
G
XX = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
1
ENA
8
ENB
INA
OUTA
GND
VDD
INB
OUTB
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 11 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
1
December, 2015 − Rev. 2
Publication Order Number:
NCP81071/D