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NCP703_13 Datasheet, PDF (1/18 Pages) ON Semiconductor – 300 mA, Ultra-Low Quiescent Current, IQ 12 A, Ultra-Low Noise, LDO Voltage Regulator
NCP703
300 mA, Ultra-Low Quiescent
Current, IQ 12 mA, Ultra-Low
Noise, LDO Voltage Regulator
Noise sensitive RF applications such as Power Amplifiers in
satellite radios, infotainment equipment, and precision
instrumentation require very clean power supplies. The NCP703 is
300 mA LDO that provides the engineer with a very stable, accurate
voltage with ultra low noise and very high Power Supply Rejection
Ratio (PSRR) suitable for RF applications. The device doesn’t require
any additional noise bypass capacitor to achieve ultra−low noise
performance. In order to optimize performance for battery operated
portable applications, the NCP703 employs dynamic Iq management
for ultra−low quiescent current consumption at light−load conditions
and great dynamic performance.
Features
• Operating Input Voltage Range: 2.0 V to 5.5 V
• Available in Fixed Voltage Options: 0.8 to 3.5 V
Contact Factory for Other Voltage Options
• Ultra−Low Quiescent Current of Typ. 12 mA
• Ultra−Low Noise: 13 mVRMS from 100 Hz to 100 kHz
• Very Low Dropout: 180 mV Typical at 300 mA
• ±2% Accuracy Over Load/Line/Temperature
• High PSRR: 68 dB at 1 kHz
• Internal Soft−Start to Limit the Turn−On Inrush Current
• Thermal Shutdown and Current Limit Protections
• Stable with a 1 mF Ceramic Output Capacitor
• Available in TSOP−5 and XDFN 1.5 x 1.5 mm Package
• Active Output Discharge for Fast Turn−Off
• These are Pb−Free Devices
Typical Applicaitons
• PDAs, Mobile Phones, GPS, Smartphones
• Wireless Handsets, Wireless LAN, Bluetooth, Zigbee
• Portable Medical Equipment
• Other Battery Powered Applications
VIN
IN
OUT
VOUT
CIN 1 mF
NCP703
EN
ON
GND
1 mF
COUT Ceramic
OFF
Figure 1. Typical Application Schematic
http://onsemi.com
5
1
TSOP−5
SN SUFFIX
CASE 483
1
XDFN6
MX SUFFIX
CASE 711AE
MARKING DIAGRAMS
5
XXXAYW
G
1
1
XM
G
X, XXX = Specific Device Code
M = Date Code
A = Assembly Location
Y = Year
W = Work Week
G = Pb−Free Package
PIN CONNECTIONS
1
IN
OUT
GND
EN
N/C
5−Pin TSOP−5
(Top View)
1
OUT
IN
N/C
N/C
GND
EN
6−Pin XDFN 1.5 x 1.5 mm
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 16 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
1
April, 2013 − Rev. 2
Publication Order Number:
NCP703/D