|
NCP57302 Datasheet, PDF (1/10 Pages) ON Semiconductor – 3.0 A, Very Low-Dropout (VLDO) Fast Transient Response Regulator | |||
|
NCP57302, NCV57302
3.0 A, Very Low-Dropout
(VLDO) Fast Transient
Response Regulator
The NCP57302 is a high precision, very low dropout (VLDO), low
minimum input voltage and low ground current positive voltage
regulator that is capable of providing an output current in excess of
3.0 A with a typical dropout voltage of 315 mV at 3.0 A load current
and input voltage from 1.8 V and up. The device is stable with ceramic
output capacitors. The device can withstand up to 18 V max input
voltage.
Internal protection features consist of output current limiting,
builtâin thermal shutdown and reverse output current protection.
Logic level enable pin is available. The NCP57302 is an adjustable
voltage device and is available in D2PAKâ5 package.
Features
ï· Output Current in Excess of 3.0 A
ï· Minimum Operating Input Voltage 1.8 V for Full 3 A Output Current
ï· 315 mV Typical Dropout Voltage at 3.0 A
ï· Adjustable Output Voltage Range from 1.24 V to 13 V
ï· Low Ground Current
ï· Fast Transient Response
ï· Stable with Ceramic Output Capacitor
ï· Logic Compatible Enable Pin
ï· Current Limit, Reverse Current and Thermal Shutdown Protection
ï· Operation up to 13.5 V Input Voltage
ï· NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECâQ100
Qualified and PPAP Capable
ï· These are PbâFree Devices
Applications
ï· Consumer and Industrial Equipment Point of Regulation
ï· Servers and Networking Equipment
ï· FPGA, DSP and Logic Power supplies
ï· Switching Power Supply Post Regulation
ï· Battery Chargers
ï· Functional Replacement for Industry Standard MIC29300,
MIC39300, MIC37300 with Improved Minimum Input Voltage
Specification
http://onsemi.com
MARKING
DIAGRAMS
TAB
1
5
D2PAK
CASE 936A
y
57302
AWLYWWG
1
y
= P (NCP), V (NCV)
A
= Assembly Location
WL = Wafer Lot
Y
= Year
WW = Work Week
G
= PbâFree Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
ï£ Semiconductor Components Industries, LLC, 2013
1
May, 2013 â Rev. 2
Publication Order Number:
NCP57302/D
|
▷ |