NCP5203 Datasheet, PDF (1/10 Pages) ON Semiconductor – 2-in-1 DDR Power Controller

NCP5203
2−in−1 DDR Power
Controller
The NCP5203 2−in−1 DDR Power Controller is a complete power
solution for an ACPI compliant high current DDR memory system.
This IC combines the efficiency of a PWM controller for the VDDQ
supply with the simplicity of linear regulator for the VTT
termination voltage. The NCP5203 contains a synchronous PWM
buck controller for driving two external NFETs to form the DDR
memory supply voltage (VDDQ). The $2.0 A user adjustable VTT
terminator regulator has short circuit protection. An internal power
good function monitors both the VDDQ and VTT outputs and signals
if a fault occurs. Protective features include soft−start, undervoltage
monitoring of 5VDUAL, over protection current (OCP), and thermal
shutdown. The IC is packaged in 18−lead QFN.
Features
• Supports DDR I and DDR II
• Incorporates VDDQ, VTT Regulators
• Operates from Single 5 V Supply
• VTT Regulator includes Integrated Power FETs Sourcing/Sinking
up to 2.0 A
• All External Power MOSFETs are N−Channel
• Adjustable VDDQ
• Adjustable VTT
• Fixed Switching Frequency of 300 kHz for VDDQ in S0
• Fixed Switching Frequency of 600 kHz for VDDQ in S3
• Soft−Start Protection for VDDQ
• Undervoltage Monitor of 5VDUAL
• Short−Circuit Protection for VDDQ and VTT
• Thermal Shutdown
• Housed in QFN−18
• Pb−Free Package is Available*
Typical Applications
• DDR Memory Supply and Termination Voltage
• Active Termination Busses (SSTL−2, SSTL−3)
http://onsemi.com
MARKING
DIAGRAM
18 ¹
1
18−LEAD QFN, 5 x 6 mm
MN SUFFIX
CASE 505
NCP5203
AWLYYWW
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
PIN CONNECTIONS
VDDQEN 1
VTTEN 2
PGOOD 3
REFSNS 4
FBVTT 5
AGND 6
SS 7
COMP 8
FBDDQ 9
18 VDDQ
17 VTT
16 PGND
15 BST
14 BGDDQ
13 TGDDQ
12 5VDUAL
11 SWDDQ
10 OCDDQ
ORDERING INFORMATION
Device
Package
Shipping^†
NCP5203MNR2
NCP5203MNR2G
QFN 2500 Tape & Reel
QFN 2500 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2005
1
January, 2005 − Rev. 1
Publication Order Number:
NCP5203/D