NCP5030MTTXGEVB Datasheet, PDF (1/14 Pages) ON Semiconductor – Buck-Boost Converter to Drive a Single LED from 1 Li-Ion or 3 Alkaline Batteries

NCP5030
Buck-Boost Converter
to Drive a Single LED from 1
Li-Ion or 3 Alkaline
Batteries
The NCP5030 is a fixed frequency PWM buck−boost converter
optimized for constant current applications such as driving
high−powered white LED. The buck−boost is implemented in an
H−bridge topology and has an adaptive architecture where it operates
in one of three modes: boost, buck−boost, or buck depending on the
input and output voltage condition. This device has been designed
with high−efficiency for use in portable applications and is capable
of driving in DC up to 900 mA into a high power LED for flashlight /
torch applications. To protect the device cycle−by−cycle current
limiting and a thermal shutdown circuit have been incorporated as
well as output over−voltage protection. The 700 kHz switching
frequency allows the use of a low value 4.7 mH and ceramic
capacitors. The NCP5030 is housed in a low profile space efficient
3x4 mm thermally enhanced WDFN.
Features
• Efficiency: 87% at 500 mA and 3.3 V V_IN
• Internal Synchronous Rectifier, No Schottky Diodes
• Adjustable Switching Limit Current to Optimize inductor size
• 0.3 mA Shut−down Control with “True−Cut off”
• Input Voltage Range from 2.7 V to 5.5 V
• 200 mV Feedback Voltage
• Output Over−voltage and Thermal Shut Down Protection
Typical Applications
• Portable Flashlight / Torch Lights
Vin
1 Cell
Cin
Li−Ion
1 mF
2.7 to 5.5
C2
10 mF
C_in
39 k
R1
ENABLE
PCA
CTRL
4.7 mH
L1
VOUT
C3
22 mF
D1
VS
C_out
NCP5030
L1: TDK RLF7030T−4R7M3R4
C1: 1 mF 6.3 V X5R
C2: 10 mF 3.6 V 0805
TDK: C2012X5R0J106MT
C3: 22 mF 6.3 V X5R
TDK: C2012X5R0J226MTJ
C4
22 pF
R2
100 k
C5
330 pF
R3
220 m
R_SENSE
Figure 1. Typical Application Circuit
http://onsemi.com
MARKING
12
DIAGRAM
1
1
WDFN12 3x4
MT SUFFIX
CASE 506AY
5030
AYWWG
G
5030 = Specific Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
FB ₁
COMP ₂
CTRL ₃
PVIN 4
LX1 5
LX1 ₆
12 PCA
11 AGND
10 VIN
13
9 ^VS
8 ^VOUT
7 ^LX2
(Top View)
Exposed pad (Pin 13) is PGND
must be soldered to PCB GND plane
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 13 of this data sheet.
© Semiconductor Components Industries, LLC, 2010
1
January, 2010 − Rev. 2
Publication Order Number:
NCP5030/D