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NCP4304_16 Datasheet, PDF (1/32 Pages) ON Semiconductor – Secondary Side Synchronous Rectification Driver for High Efficiency SMPS Topologies
NCP4304A, NCP4304B
Secondary Side
Synchronous Rectification
Driver for High Efficiency
SMPS Topologies
The NCP4304A/B is a full featured controller and driver tailored to
control synchronous rectification circuitry in switch mode power
supplies. Due to its versatility, it can be used in various topologies such
as flyback, forward and Half Bridge Resonant LLC.
The combination of externally adjustable minimum on and off times
helps to fight the ringing induced by the PCB layout and other
parasitic elements. Therefore, a reliable and noise less operation of the
SR system is insured.
The extremely low turn off delay time, high sink current capability
of the driver and automatic package parasitic inductance
compensation system allow to maximize synchronous rectification
MOSFET conduction time that enables further increase of SMPS
efficiency.
Finally, a wide operating VCC range combined with two versions of
driver voltage clamp eases implementation of the SR system in 24 V
output applications.
Features
• Self-Contained Control of Synchronous Rectifier in CCM, DCM,
and QR Flyback Applications
• Precise True Secondary Zero Current Detection with Adjustable
Threshold
• Automatic Parasitic Inductance Compensation Input
• Typically 40 ns Turn off Delay from Current Sense Input to Driver
• Zero Current Detection Pin Capability up to 200 V
• Optional Ultrafast Trigger Interface for Further Improved
Performance in Applications that Work in Deep CCM
• Disable Input to Enter Standby or Low Consumption Mode
• Adjustable Minimum On Time Independent of VCC Level
• Adjustable Minimum Off Time Independent of VCC Level
• 5 A/2.5 A Peak Current Sink/Source Drive Capability
• Operating Voltage Range up to 30 V
• Gate Drive Clamp of Either 12 V (NCP4304A) or 6 V (NCP4304B)
• Low Startup and Standby Current Consumption
• Maximum Frequency of Operation up to 500 kHz
• SOIC−8 Package
• These are Pb−Free Devices
Typical Applications
• Notebook Adapters
• High Power Density AC/DC Power Supplies
• Gaming Consoles
• All SMPS with High Efficiency Requirements
www.onsemi.com
8
1
SOIC−8
D SUFFIX
CASE 751
1
DFN8
MN SUFFIX
CASE 488AF
MARKING DIAGRAMS
8
4304x
ALYW G
G
1
NCP
4304x
ALYWG
G
SOIC−8
DFN8
4304x
A
L
Y
W
G
= Specific Device Code
x = A or B
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(*Note: Microdot may be in either location)
PINOUT INFORMATION
VCC
MIN_TOFF
MIN_TON
TRIG/DIS
18
27
36
45
DRV
GND
COMP
CS
(NOTE: For DFN the exposed pad must be either
unconnected or preferably connected to ground.
The GND pin must be always connected to ground.)
ORDERING INFORMATION
Device
Package Shipping†
NCP4304ADR2G
NCP4304BDR2G
SOIC−8
(Pb−Free)
SOIC−8
(Pb−Free)
2,500 /
Tape & Reel
2,500 /
Tape & Reel
NCP4304AMNTWG DFN8
4,000 /
(Pb−Free) Tape & Reel
NCP4304BMNTWG DFN8
4,000 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
1
March, 2016 − Rev. 6
Publication Order Number:
NCP4304/D