NCP383 Datasheet, PDF (1/10 Pages) ON Semiconductor – Adjustable Current-Limiting Power-Distribution Switches

NCP383
Adjustable Current-Limiting
Power-Distribution
Switches
The NCP383 is a single input dual outputs power−distribution
switch designed for applications where heavy capacitive loads and
short−circuits are likely to be encountered, incorporating two very low
R_DS(on), N−channel MOSFETs in a single package. Each channel of
the device limits the output current to a desired level by switching into
a constant−current mode when the output load exceeds the
current−limit threshold or a short circuit is present. The current−limit
threshold is externally fixed by a pull down resistor placed between
I_lim and GND. The power−switches rise and fall times are controlled to
minimize current ringing during turn on/off.
An internal reverse−voltage detection comparator disables the
power−switch if the output voltage is higher than the input voltage to
protect devices on the input side of the switches.
The /FLAGx logic output asserts low during over−current,
reverse−voltage or over temperature conditions. The switch is
controlled by a logic enable input active low.
Features
• 2.7 V – 5.5 V Operating Range
• Current limit: Adjustable up to 2.8 A
• ± 7.5% Current Limit Accuracy at 2.8 A
• Very fast Over−Current Detection Response: 2 ms (typ)
• 1 mA Maximum Standby Supply Current
• Under Voltage Lock−out (UVLO)
• Soft−Start Prevents Inrush Current
• Thermal Protection
• Soft Turn−off
• Reverse Voltage Protection
• Enable Active Low
• mDFN 3x3 mm
• Compliance to IEC61000−4−2 (Level 4)
8.0 kV (Contact) − 15 kV (Air)
• UL Listed – File E343275
• CB − IEC60950−ED2 Certified
• CB – IEC60950−ED2−AM1 Certified
• This is a Pb−Free Device
Typical Applications
• Laptops
• USB Ports/Hubs
• TVs
http://onsemi.com
UDFN10
CASE 517CC
MARKING
DIAGRAM
383
ALYWG
G
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(*Note: Microdot may be in either location)
PIN CONNECTIONS
GND 1
IN 2
IN 3
EN1 4
EN2 5
10 /FLAG1
9 OUT1
8 OUT2
7 ILIM
6 /FLAG2
(Top View)
Exposed pad must be soldered to PCB Ground plane.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
© Semiconductor Components Industries, LLC, 2012
1
October, 2012 − Rev. 2
Publication Order Number:
NCP383/D