NCP3163_07 Datasheet, PDF (1/20 Pages) ON Semiconductor – 3.4 A, Step−Up/Down/Inverting 50−300 kHz Switching Regulator

NCP3163, NCV3163
3.4 A, Step−Up/Down/
Inverting 50−300 kHz
Switching Regulator
The NCP3163 Series is a performance enhancement to the popular
MC33163 and MC34163 monolithic DC−DC converters. These
devices consist of an internal temperature compensated reference,
comparator, controlled duty cycle oscillator with an active current
limit circuit, driver and high current output switch. This controller was
specifically designed to be incorporated in step−down, step−up, or
voltage−inverting applications with a minimum number of external
components. The NCP3163 comes in an exposed pad package which
can greatly increase the power dissipation of the built in power switch.
Features
• Output Switch Current in Excess of 3.0 A
• 3.4 A Peak Switch Current
• Frequency is Adjustable from 50 kHz to 300 kHz
• Operation from 2.5 V to 40 V Input
• Externally Adjustable Operating Frequency
• Precision 2% Reference for Accurate Output Voltage Control
• Driver with Bootstrap Capability for Increased Efficiency
• Cycle−by−Cycle Current Limiting
• Internal Thermal Shutdown Protection
• Low Voltage Indicator Output for Direct Microprocessor Interface
• Exposed Pad Power Package
• Low Standby Current
• NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
• These are Pb−Free Devices
Current
8
− ^Limit
9
+
V_{in + 7}
10
C_in
V_CC
6 Oscillator
11
5
R
12
Q
Thermal
S
4
13
V_CC
3
14
2
+
+
15
−
1
+
+
−
LVI
16
V_CC
(Bottom View)
Figure 1. Typical Buck Application Circuit
V_out
C_O ⁺
http://onsemi.com
16
1
SOIC−16W
EXPOSED PAD
PW SUFFIX
CASE 751AG
MARKING
DIAGRAMS
16
NCx3163yPW
AWLYYWWG
1
1
18
18
18−LEAD DFN ^NCP3163y
1
MN SUFFIX ^{AWLYYWW G}
CASE 505
G
NCx3163x
A
WL
YY
WW
G or G
= Specific Device Code
x = P or V
y = blank or B
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 18 of this data sheet.
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2007
1
January, 2007 − Rev. 4
Publication Order Number:
NCP3163/D