NCP2990 Datasheet, PDF (1/13 Pages) ON Semiconductor – 1.3 Watt Audio Power Amplifier with Fast Turn On Time

NCP2990
1.3 Watt Audio Power
Amplifier with Fast Turn On
Time
The NCP2990 is an audio power amplifier designed for portable
communication device applications such as mobile phone
applications. The NCP2990 is capable of delivering 1.3 W of
continuous average power to an 8.0 W BTL load from a 5.0 V power
supply, and 1.0 W to a 4.0 W BTL load from a 3.6 V power supply.
The NCP2990 provides high quality audio while requiring few
external components and minimal power consumption. It features a
low−power consumption shutdown mode, which is achieved by
driving the SHUTDOWN pin with logic low.
The NCP2990 contains circuitry to prevent from “pop and click”
noise that would otherwise occur during turn−on and turn−off
transitions. It is a zero pop noise device when a single ended audio
input is used.
For maximum flexibility, the NCP2990 provides an externally
controlled gain (with resistors), as well as an externally controlled
turn−on time (with the bypass capacitor). When using a 1 mF bypass
capacitor, it offers 60 ms wake up time.
Due to its superior PSRR, it can be directly connected to the
battery, saving the use of an LDO.
This device is available in a 9−Pin Flip−Chip CSP (Lead−Free).
Features
• 1.3 W to an 8.0 W BTL Load from a 5.0 V Power Supply
• Superior PSRR: Direct Connection to the Battery
• Zero Pop Noise Signature with a Single Ended Audio Input
• Ultra Low Current Shutdown Mode: 10 nA
• 2.2 V−5.5 V Operation
• External Gain Configuration Capability
• External Turn−on Time Configuration Capability:
60 ms (1 mF Bypass Capacitor)
• Up to 1.0 nF Capacitive Load Driving Capability
• Thermal Overload Protection Circuitry
• This is a Pb−Free Device*
Typical Applications
• Portable Electronic Devices
• PDAs
• Wireless Phones
http://onsemi.com
MARKING
DIAGRAMS
9−Pin Flip−Chip CSP ^A3
FC SUFFIX
MBAG
1
CASE 499E
AYWW
C1
A1
MBA
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
PIN CONNECTIONS
9−Pin Flip−Chip CSP
A1
A2
A3
INM OUTA INP
B1
B2
B3
VM_P VM
V_p
C1
C2
C3
BYPASS OUTB SHUTDOWN
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
September, 2006 − Rev. 0
Publication Order Number:
NCP2990/D