NCP2890_06 Datasheet, PDF (1/16 Pages) ON Semiconductor – 1.0 Watt Audio Power Amplifier

NCP2890, NCV2890
1.0 Watt Audio Power
Amplifier
The NCP2890 is an audio power amplifier designed for portable
communication device applications such as mobile phone
applications. The NCP2890 is capable of delivering 1.0 W of
continuous average power to an 8.0 W BTL load from a 5.0 V power
supply, and 320 mW to a 4.0 W BTL load from a 2.6 V power supply.
The NCP2890 provides high quality audio while requiring few
external components and minimal power consumption. It features a
low−power consumption shutdown mode, which is achieved by
driving the SHUTDOWN pin with logic low.
The NCP2890 contains circuitry to prevent from “pop and click”
noise that would otherwise occur during turn−on and turn−off
transitions.
For maximum flexibility, the NCP2890 provides an externally
controlled gain (with resistors), as well as an externally controlled
turn−on time (with the bypass capacitor).
Due to its excellent PSRR, it can be directly connected to the
battery, saving the use of an LDO.
This device is available in a 9−Pin Flip−Chip CSP (standard
Tin−Lead and Lead−Free versions) and a Micro8t package.
Features
• 1.0 W to an 8.0 W BTL Load from a 5.0 V Power Supply
• Excellent PSRR: Direct Connection to the Battery
• “Pop and Click” Noise Protection Circuit
• Ultra Low Current Shutdown Mode
• 2.2 V−5.5 V Operation
• External Gain Configuration Capability
• External Turn−on Time Configuration Capability
• Up to 1.0 nF Capacitive Load Driving Capability
• Thermal Overload Protection Circuitry
• AEC−Q100 Qualified Part Available
• Pb−Free Packages are Available
• NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
Typical Applications
• Portable Electronic Devices
• PDAs
• Wireless Phones
http://onsemi.com
MARKING
DIAGRAMS
9−Pin Flip−Chip CSP ^A3
FC SUFFIX
XXX
1
CASE 499E
AYWWG
C1
A1
8
8
1
Micro8
DM SUFFIX
CASE 846A
XXX
RYWG
G
1
XXX = Specific Device Code,
A, R = Assembly Location
Y
= Year
WW, W = Work Week
G
= Pb−Free Package
PIN CONNECTIONS
9−Pin Flip−Chip CSP
A1
A2
A3
INM OUTA INP
B1
B2
B3
VM_P VM
V_p
C1
C2
C3
BYPASS OUTB SHUTDOWN
(Top View)
SHUTDOWN 1
BYPASS 2
INP 3
INM 4
Micro8
(Top View)
8 OUTB
7 VM
6 V_p
5 OUTA
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 14 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
November, 2006 − Rev. 10
Publication Order Number:
NCP2890/D