NCP2830 Datasheet, PDF (1/15 Pages) ON Semiconductor – 1W Constant Filterless Class-D Audio Amplifier

NCP2830
1W Constant Filterless
Class-D Audio Amplifier
NCP2830 is a cost effective mono audio power amplifier designed
for portable communication device applications such as mobile
phones. Due to its integrated charge pump structure, this part is
capable of delivering 1 W of continuous average power to an 8.0 W
Bridge Tied Load no matter the voltage provided by a lithium/Ion
battery.
NCP2830 is a preferred solution for long playback audio with
minimum space required.
Added to a fast start−up time of 200 ms and a −88dB PSRR, the
NCP2830 audio power amplifier is specifically designed to provide
high quality and level output power from low supply voltage,
requiring very few external components.
Features
• 1 W to 8 W load for V_DD from 2.7 V up to 5.5 V
• High quality audio (THD+N = 0.04%)
• Low noise: SNR up to 100 dB
• Very Fast Turn On Time: 200 ms
• Overall system efficiency optimization: up to 89%
• Superior PSRR (−88 dB): Direct Connection to Battery
• Very Low Quiescent Current 7 mA
• Optimized PWM Output Stage: Filterless Capability
• Selectable gain of 2 V/V or 4 V/V
• Fully Differential Capability:
• Thin QFN 3x3 mm, 20 pins
• This Device uses Halogen−Free Molding Compound
• This is a Pb−Free Device
Typical Applications
• Cellular Phones and Digital Cameras
• Personal Digital Assistant and Portable Media Player
• Audio Accessories
• GPS
Battery
+
C1
−
4.7 mF
6.3 V
Digital Control
Audio Inputs
2.2 mF, C3
6.3 V
C1P
C2
4.7 mF
6.3 V
PVDD
AVDD
WM
GS
SD
C4
C1N C2P
2.2 mF,
6.3 V
C2N
VB_OUT
VB_IN
NCP2830
1 mF
1 mF
C7
INM
OUTM
C8 _INP
PGND_D PGND_CP
AGND RES1 RES2
OUTP
C6
10 mF,
6.3 V
C5
10 mF,
6.3 V
http://onsemi.com
UQFN20
MU SUFFIX
CASE 523AL
MARKING
DIAGRAM
20
1
XXXX
ALYWG
G
XXXX = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
20 19 18 17 16
INP 1
INM 2
AGND 3
AVDD 4
WM 5
15 VB_OUT
14 C1P
13 C2P
12 PVDD
11 RES1
6 7 8 9 10
(TOP VIEW)
20−Pin 3 x 3 x 0.50 mm QFN
Exposed pad must be soldered to
PCB Ground Plane
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 14 of this data sheet.
Figure 1. Typical Application Circuit
© Semiconductor Components Industries, LLC, 2009
1
August, 2009 − Rev. 0
Publication Order Number:
NCP2830/D