NCP2809_06 Datasheet, PDF (1/22 Pages) ON Semiconductor – NOCAP 135 mW Stereo Headphone Power Amplifier

NCP2809 Series
NOCAPt 135 mW Stereo
Headphone Power Amplifier
The NCP2809 is a cost−effective stereo audio power amplifier
capable of delivering 135 mW of continuous average power per
channel into 16 W loads.
The NCP2809 audio power amplifier is specifically designed to
provide high quality output power from low supply voltage,
requiring very few external components. Since NCP2809 does not
require bootstrap capacitors or snubber networks, it is optimally
suited for low−power portable systems. NCP2809A has an internal
gain of 0 dB while specific external gain can externally be set with
NCP2809B.
If the application allows it, the virtual ground provided by the
device can be connected to the middle point of the headset (Figure 1).
In such case, the two external heavy coupling capacitors typically
used can be removed. Otherwise, you can also use both outputs in
single ended mode with external coupling capacitors (Figure 43).
Due to its excellent Power Supply Rejection Ratio (PSRR), it can
be directly connected to the battery, saving the use of an LDO.
Features
• 135 mW to a 16 W Load from a 5.0 V Power Supply
• Excellent PSRR (85 dB Typical): Direct Connection to the Battery
• “Pop and Click” Noise Protection Circuit
• Ultra Low Current Shutdown Mode
• 2.2 V–5.5 V Operation
• Outstanding Total Harmonics Distortion + Noise (THD+N): Less
than 0.01%
• External Turn−on and Turn−off Configuration Capability
• Thermal Overload Protection Circuitry
• Pb−Free Packages are Available
Typical Applications
• Cellular Phone
• Portable Stereo
• MP3 Player
• Personal and Notebook Computers
http://onsemi.com
MARKING
DIAGRAM
10
1
Micro10
DM SUFFIX
CASE 846B
MAx
AYWG
G
x = E for NCP2809A
C for NCP2809B
A = Assembly Location
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
IN_R 1
SD ₂
BYP 3
REF_I 4
IN_L 5
10 OUT_R
9 VM
8 OUT_I
7 V_P
6 OUT_L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 20 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
January, 2006 − Rev. 8
Publication Order Number:
NCP2809/D