NCP1526 Datasheet, PDF (1/16 Pages) ON Semiconductor – 400 mA, 1.2 V, High−Efficiency, Step−Down Converter with Low Noise Voltage Regulator Optimized for RF Module

NCP1526
400 mA, 1.2 V,
High−Efficiency, Step−Down
Converter with Low Noise
Voltage Regulator
Optimized for RF Module
The NCP1526 product is a monolithic integrated circuit combining
step−down PWM DC−DC converter dedicated to the portable
applications powered from one cell Li−ion or three cell Alkaline/
NiCd/NiMH batteries and a low noise output voltage regulator
dedicated to supply RF sensitive module in the portable applications.
The DC−DC converter operates with a fixed output voltage of
1.2 V and delivers up to 400 mA. It uses synchronous rectification to
increase efficiency and reduces external part count. The device also
has a built−in 3.0 MHz (nominal) oscillator which reduces
component size by allowing small inductor and capacitors. It
includes an integrated soft−start, cycle−by−cycle current limiting,
and thermal shutdown protection.
The additional 2.80 V very low noise, low drop output regulator, is
available with 150 mA current capability, current limitation and
overtemperature protection.
Finally, the NCP1526 is available in a space saving, ultra low
profile 3x3 mm 10 pin UDFN package (thickness 0.55 mm max).
Features
• Step−Down Converter
− Up to 85% Efficiency
− Output Current Capability 400 mA
− 3.0 MHz Switching Frequency
− 1.2 V Fixed Output Voltage
− Synchronous Rectification for Higher Efficiency
• LDO Regulator
− 2.80 V Output Voltage
− Up to 150 mA Output Current Capability
− Very Low Noise: 45 mV_RMS
• All Pins are Fully ESD Protected
• 2.7 V to 5.5 V Input Voltage Range
• Thermal Limit Protection
• 3.0 mm x 3.0 mm x 0.55 mm UDFN Package
• This is a Pb−Free Device
Typical Applications
• Cellular Phones, Smart Phones and PDAs
• Digital Still Cameras
• MP3 Players and Portable Audio Systems
• Wireless and DSL Modems
• Portable Equipment
http://onsemi.com
MARKING
DIAGRAM
10 PIN DFN
MU SUFFIX
CASE 506AT
1526
ALYWG
G
1526
A
L
Y
W
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
FB
EN1
EN2
GND2
BYPASS
(Top View)
VIN1
LX
GND1
VIN2
V1
ORDERING INFORMATION
Device
Package
Shipping^†
NCP1526MUTXG
UDFN−10 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
July, 2006 − Rev. 0
Publication Order Number:
NCP1526/D