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NBSG16 Datasheet, PDF (1/12 Pages) ON Semiconductor – 2.5V/3.3V SiGe Differential Receiver/Driver with RSECL Outputs
NBSG16
2.5V/3.3V SiGe Differential
Receiver/Driver with
RSECL* Outputs
*Reduced Swing ECL
Description
The NBSG16 is a differential receiver/driver targeted for high
frequency applications. The device is functionally equivalent to the
EP16 and LVEP16 devices with much higher bandwidth and lower
EMI capabilities.
Inputs incorporate internal 50 W termination resistors and accept
NECL (Negative ECL), PECL (Positive ECL), HSTL, LVTTL,
LVCMOS, CML, or LVDS. Outputs are RSECL (Reduced Swing
ECL), 400 mV.
The VBB and VMM pins are internally generated voltage supplies
available to this device only. The VBB is used as a reference voltage
for single−ended NECL or PECL inputs and the VMM pin is used as a
reference voltage for LVCMOS inputs. For all single−ended input
conditions, the unused complementary differential input is connected
to VBB or VMM as a switching reference voltage. VBB or VMM may
also rebias AC coupled inputs. When used, decouple VBB and VMM
via a 0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA.
When not used, VBB and VMM outputs should be left open.
Features
• Maximum Input Clock Frequency > 12 GHz Typical
• Maximum Input Data Rate > 12 Gb/s Typical
• 120 ps Typical Propagation Delay
• 40 ps Typical Rise and Fall Times
• RSPECL Output with Operating Range: VCC = 2.375 V to 3.465 V
with VEE = 0 V
• RSNECL Output with RSNECL or NECL Inputs with
Operating Range: VCC = 0 V with VEE = −2.375 V to −3.465 V
• RSECL Output Level (400 mV Peak−to−Peak Output), Differential
Output Only
• 50 W Internal Input Termination Resistors
• Compatible with Existing 2.5 V/3.3 V LVEP, EP, and LVEL Devices
• VBB and VMM Reference Voltage Output
• Pb−Free Packages are Available
http://onsemi.com
MARKING DIAGRAMS*
FCBGA−16
BA SUFFIX
CASE 489
QFN−16
MN SUFFIX
CASE 485G
SG
16
ALYW
16
1
ÇÇÇÇ SG
16
ALYWG
G
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
July, 2006 − Rev. 14
Publication Order Number:
NBSG16/D