NB7V33M Datasheet, PDF (1/10 Pages) ON Semiconductor – 1.8V / 2.5V, 10GHz ÷4 Clock Divider with CML Outputs

NB7V33M
1.8V / 2.5V, 10GHz ÷4 Clock
Divider with CML Outputs
Multi−Level Inputs w/ Internal Termination
Description
The NB7V33M is a differential B4 Clock divider with
asynchronous reset. The differential Clock inputs incorporate internal
50 W termination resistors and will accept LVPECL, CML and LVDS
logic levels. The NB7V33M produces a ÷4 output copy of an input
Clock operating up to 10 GHz with minimal jitter. The Reset pin is
asserted on the rising edge. Upon powerup, the internal flip*flops
will attain a random state; the Reset allows for the synchronization of
multiple NB7V33M’s in a system. The 16 mA differential CML
output provides matching internal 50 W termination which guarantees
400 mV output swing when externally receiver terminated with 50 W
to V_CC.
The NB7V33M is the B4 version of the NB7V32M (B2) and is
offered in a low profile 3 mm x 3 mm 16−pin QFN package.
The NB7V33M is a member of the GigaComm™ family of high
performance clock products. Application notes, models, and support
documentation are available at www.onsemi.com.
Features
• Maximum Input Clock Frequency > 10 GHz, typical
• 260 ps Typical Propagation Delay
• 35 ps Typical Rise and Fall Times
• Differential CML Outputs, 400 mV Peak−to−Peak, Typical
• Operating Range: V_CC = 1.71 V to 2.625 V with GND = 0 V
• Internal 50 W Input Termination Resistors
• Random Clock Jitter < 0.8 ps RMS
• QFN−16 Package, 3 mm x 3 mm
• −40ºC to +85°C Ambient Operating Temperature
• These are Pb−Free Devices
http://onsemi.com
1
QFN16
MN SUFFIX
CASE 485G
MARKING
DIAGRAM*
16
1
NB7V
33M
ALYW G
G
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
R
VTCLK
50 W
RESET
CLK
B4
Q0
CLK
Q0
50 W
VTCLK
V_REFAC
V_CC
GND
Figure 1. Simplified Logic Diagram
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
© Semiconductor Components Industries, LLC, 2010
1
January, 2010 − Rev. 2
Publication Order Number:
NB7V33M/D