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N64S818HA_12 Datasheet, PDF (1/13 Pages) ON Semiconductor – 64 kb Low Power Serial SRAMs
N64S818HA
64 kb Low Power Serial
SRAMs
8 k x 8 Bit Organization
Introduction
The ON Semiconductor serial SRAM family includes several
integrated memory devices including this 64 k serially accessed Static
Random Access Memory, internally organized as 8 k words by 8 bits.
The devices are designed and fabricated using ON Semiconductor’s
advanced CMOS technology to provide both high−speed performance
and low power. The devices operate with a single chip select (CS)
input and use a simple Serial Peripheral Interface (SPI) serial bus. A
single data in and data out line is used along with a clock to access data
within the devices. The N64S818HA devices include a HOLD pin that
allows communication to the device to be paused. While paused, input
transitions will be ignored. The devices can operate over a wide
temperature range of −40°C to +85°C and can be available in several
standard package offerings.
Features
• Power Supply Range: 1.7 to 1.95 V
• Very Low Standby Current: As low as 200 nA
• Very Low Operating Current: As low as 3 mA
• Simple Memory Control:
Single chip select (CS)
Serial input (SI) and serial output (SO)
• Flexible Operating Modes:
Word read and write
Page mode (32 word page)
Burst mode (full array)
• Organization: 8 k x 8 bit
• Self Timed Write Cycles
• Built−in Write Protection (CS High)
• HOLD Pin for Pausing Communication
• High Reliability: Unlimited write cycles
• Green SOIC and TSSOP
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
http://onsemi.com
MARKING
DIAGRAMS
TSSOP−8
T SUFFIX
CASE 948AL
A124
XXXXYZZ
SOIC−8
S SUFFIX
CASE 751BD
A114
XXXXYZZ
XXXX = Date Code
Y
= Assembly Code
ZZ
= Lot Traceability
ORDERING INFORMATION
Device
Package
Shipping†
N64S818HAS21I
SOIC−8 100 Units / Tube
(Pb−Free)
N64S818HAT21I
TSSOP−8 100 Units / Tube
(Pb−Free)
N64S818HAS21IT SOIC−8 3000 / Tape &
(Pb−Free)
Reel
N64S818HAT21IT TSSOP−8 3000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
1
June, 2012 − Rev. 11
Publication Order Number:
N64S818HA/D