N25S830HA_14 Datasheet, PDF (1/12 Pages) ON Semiconductor – 256 kb Low Power Serial SRAMs

N25S830HA
256 kb Low Power Serial
SRAMs
32 k x 8 Bit Organization
Introduction
The ON Semiconductor serial SRAM family includes several
integrated memory devices including this 256 kb serially accessed
Static Random Access Memory, internally organized as 32 k words by
8 bits. The devices are designed and fabricated using
ON Semiconductor’s advanced CMOS technology to provide both
high−speed performance and low power. The devices operate with a
single chip select (CS) input and use a simple Serial Peripheral
Interface (SPI) serial bus. A single data in and data out line is used
along with a clock to access data within the devices. The N25S830HA
devices include a HOLD pin that allows communication to the device
to be paused. While paused, input transitions will be ignored. The
devices can operate over a wide temperature range of −40°C to +85°C
and can be available in several standard package offerings.
Features
• Power Supply Range: 2.7 to 3.6 V
• Very Low Standby Current: Typical Isb as low as 1 mA
• Very Low Operating Current: As low as 3 mA
• Simple Memory Control:
Single chip select (CS)
Serial input (SI) and serial output (SO)
• Flexible Operating Modes:
Word read and write
Page mode (32 word page)
Burst mode (full array)
• Organization: 32 K x 8 bit
• Self Timed Write Cycles
• Built−in Write Protection (CS High)
• HOLD Pin for Pausing Communication
• High Reliability: Unlimited write cycles
• Green SOIC and TSSOP
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
www.onsemi.com
MARKING
DIAGRAMS
TSSOP−8
T SUFFIX
CASE 948AL
D125
XXXXYZZ
SOIC−8
S SUFFIX
CASE 751BD
D115
XXXXYZZ
XXXX = Date Code
Y
= Assembly Code
ZZ
= Lot Traceability
ORDERING INFORMATION
Device
Package
Shipping^†
N25S830HAS22I SOIC−8 100 Units / Tube
(Pb−Free)
N25S830HAT22I
TSSOP−8 100 Units / Tube
(Pb−Free)
N25S830HAS22IT SOIC−8 3000 / Tape &
(Pb−Free)
Reel
N25S830HAT22IT TSSOP−8 3000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
December, 2014 − Rev. 11
Publication Order Number:
N25S830HA/D