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MTB75N03HDL Datasheet, PDF (1/12 Pages) Motorola, Inc – TMOS POWER FET LOGIC LEVEL 75 AMPERES 25 VOLTS
MTB75N03HDL
Preferred Device
Power MOSFET
75 Amps, 25 Volts, Logic Level
N−Channel D2PAK
This Power MOSFET is designed to withstand high energy in the
avalanche and commutation modes. The energy efficient design also
offers a drain−to−source diode with a fast recovery time. Designed for
low voltage, high speed switching applications in power supplies,
converters and PWM motor controls, these devices are particularly
well suited for bridge circuits where diode speed and commutating
safe operating areas are critical and offer additional safety margin
against unexpected voltage transients.
• Avalanche Energy Specified
• Source−to−Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
• Diode is Characterized for Use in Bridge Circuits
• IDSS and VDS(on) Specified at Elevated Temperature
• Short Heatsink Tab Manufactured − Not sheared
• Specially Designed Leadframe for Maximum Power Dissipation
http://onsemi.com
75 AMPERES
25 VOLTS
RDS(on) = 9 mΩ
N−Channel
D
G
S
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol Value
Drain−to−Source Voltage
Drain−to−Gate Voltage (RGS = 1.0 MΩ)
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (tp ≤ 10 ms)
Drain Current − Continuous
Drain Current − Continuous @ 100°C
Drain Current − Single Pulse (tp ≤ 10 µs)
Total Power Dissipation
Derate above 25°C
Total Power Dissipation @ TA = 25°C
(Note 1.)
VDSS
VDGR
VGS
VGSM
ID
ID
IDM
PD
25
25
± 15
± 20
75
59
225
125
1.0
2.5
Operating and Storage Temperature
Range
− 55 to 150
Single Pulse Drain−to−Source Avalanche
EAS
280
Energy − Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 5.0 Vdc,
IL = 75 Apk, L = 0.1 mH, RG = 25 Ω)
Thermal Resistance
− Junction to Case
− Junction to Ambient
− Junction to Ambient (Note 1.)
RθJC
RθJA
RθJA
1.0
62.5
50
Maximum Lead Temperature for Soldering
TL
260
Purposes, 1/8″ from case for 10
seconds
1. When mounted with the minimum recommended pad size.
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
Watts
W/°C
Watts
°C
mJ
°C/W
°C
12
3
4
D2PAK
CASE 418B
STYLE 2
MARKING DIAGRAM
& PIN ASSIGNMENT
4
Drain
T75N03HDL
YWW
12
Gate Drain
3
Source
T75N03HDL
Y
WW
= Device Code
= Year
= Work Week
ORDERING INFORMATION
Device
Package
Shipping
MTB75N03HDL
MTB75N03HDLT4
D2PAK
D2PAK
50 Units/Rail
800/Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2000
1
September, 2004 − Rev. XXX
Publication Order Number:
MTB75N03HDL/D