MSQA6V1W5T2_06 Datasheet, PDF (1/4 Pages) ON Semiconductor – Quad Array for ESD Protection

MSQA6V1W5T2
Quad Array for
ESD Protection
This quad monolithic silicon voltage suppressor is designed for
applications requiring transient overvoltage protection capability. It is
intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment, and other applications. Its quad junction common
anode design protects four separate lines using only one package.
These devices are ideal for situations where board space is at a
premium.
Features
• SC−88A Package Allows Four Separate Unidirectional
Configurations
• Low Leakage < 1 mA @ 3 V
• Breakdown Voltage: 6.1 V − 7.2 V @ 1 mA
• Low Capacitance (90 pF typical)
• ESD Protection Meeting IEC1000−4−2
• Pb−Free Package is Available*
Mechanical Characteristics:
• Void Free, Transfer−Molded, Thermosetting Plastic Case
• Corrosion Resistant Finish, Easily Solderable
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Peak Power Dissipation @ 20 ms
@T_A ≤ 25°C (Note 1)
Steady State Power − 1 Diode (Note 2)
Thermal Resistance, Junction−to−Ambient
Above 25°C, Derate
P_pk
P_D
R_qJA
150
W
385
mW
325
°C/W
3.1
mW/°C
Maximum Junction Temperature
Operating Junction and Storage
Temperature Range
T_Jmax
150
°C
T_J T_stg −55 to +150 °C
ESD Discharge
MIL STD 883C − Method 3015−6
V_PP
kV
16
IEC1000−4−2, Air Discharge
16
IEC1000−4−2, Contact Discharge
9
Lead Solder Temperature (10 s duration)
T_L
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Non−repetitive current per Figure 1. Derate per Figure 2.
2. Only 1 diode under power. For all 4 diodes under power, P_D will be 25%.
Mounted on FR−4 board with min pad.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
February, 2006 − Rev. 4
http://onsemi.com
1
5
2
3
4
SC−88A/SOT−323
CASE 419A
MARKING DIAGRAM
61 M G
G
61 = Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
MSQA6V1W5T2 SC−88A 3000/Tape & Reel
MSQA6V1W5T2G SC−88A 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*T2 Suffix Devices are Packaged with Pin 1 Opposing
Sprocket Hole.
Publication Order Number:
MSQA6V1W5T2/D