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MMSZ4680ET1G Datasheet, PDF (1/5 Pages) ON Semiconductor – Zener Voltage Regulators | |||
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MMSZ4xxxET1G Series,
SZMMSZ4xxxET1G Series
Zener Voltage Regulators
500 mW SODâ123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SODâ123 package. These devices provide a
convenient alternative to the leadless 34âpackage style.
Features
ï· 500 mW Rating on FRâ4 or FRâ5 Board
ï· Wide Zener Reverse Voltage Range â 1.8 V to 43 V
ï· Package Designed for Optimal Automated Board Assembly
ï· Small Package Size for High Density Applications
ï· ESD Rating of Class 3 (> 16 kV) per Human Body Model
ï· Peak Power â 225 W (8 x 20 ms)
ï· AECâQ101 Qualified and PPAP Capable
ï· SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
ï· PbâFree Packages are Available*
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260ï°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 Vâ0
MAXIMUM RATINGS
Rating
Symbol Max Unit
Peak Power Dissipation @ 20 ms (Note 1)
@ TL ï£ 25ï°C
Ppk
225
W
Total Power Dissipation on FRâ5 Board,
(Note 2) @ TL = 75ï°C
Derated above 75ï°C
PD
500
mW
6.7 mW/ï°C
Thermal Resistance, (Note 3)
JunctionâtoâAmbient
RqJA
ï°C/W
340
Thermal Resistance, (Note 3)
JunctionâtoâLead
RqJL
ï°C/W
150
Junction and Storage Temperature Range
TJ, Tstg â55 to
ï°C
+150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 11.
2. FRâ5 = 3.5 x 1.5 inches, using the minimum recommended footprint.
3. Thermal Resistance measurement obtained via infrared Scan Method.
*For additional information on our PbâFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ï£ Semiconductor Components Industries, LLC, 2012
1
January, 2012 â Rev. 6
http://onsemi.com
SODâ123
CASE 425
STYLE 1
1
Cathode
2
Anode
MARKING DIAGRAM
1
xxx M G
G
xxx = Device Code (Refer to page 2)
M = Date Code
G = PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shippingâ
MMSZ4xxxET1G
SODâ123
(PbâFree)
3,000 /
Tape & Reel
SZMMSZ4xxxET1G SODâ123
(PbâFree)
3,000 /
Tape & Reel
MMSZ4xxxET3G
SODâ123
(PbâFree)
10,000 /
Tape & Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
Publication Order Number:
MMSZ4678ET1/D
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