MMSZ2V4T1_06 Datasheet, PDF (1/7 Pages) ON Semiconductor – Zener Voltage Regulators 500 mW SOD−123 Surface Mount

MMSZ2V4T1 Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
Features
• 500 mW Rating on FR−4 or FR−5 Board
• Wide Zener Reverse Voltage Range − 2.4 V to 56 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Pb−Free Packages are Available
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Total Power Dissipation on FR−5 Board,
P_D
(Note 1) @ T_L = 75°C
Derated above 75°C
500
mW
6.7
mW/°C
Thermal Resistance, Junction−to−Ambient R_qJA
(Note 2)
340
°C/W
Thermal Resistance, Junction−to−Lead
(Note 2)
R_qJL
150
°C/W
Junction and Storage Temperature Range T_J, T_stg −55 to +150 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−5 = 3.5 X 1.5 inches.
2. Thermal Resistance measurement obtained via infrared Scan Method.
http://onsemi.com
1
Cathode
2
Anode
2
1
SOD−123
CASE 425
STYLE 1
MARKING DIAGRAM
1
xx M G
G
xx = Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
MMSZxxxT1
SOD−123
(Pb−Free)
3000/Tape & Reel
MMSZxxxT3
SOD−123 10,000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
Juanuary, 2006 − Rev. 9
Publication Order Number:
MMSZ2V4T1/D