MMDL6050T1G Datasheet, PDF(1/3 Page) ON Semiconductor

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MMDL6050T1G Datasheet, PDF (1/3 Pages) ON Semiconductor – Switching Diode

MMDL6050T1G,

SMMDL6050T1G

Switching Diode

Features

ï· AECâQ101 Qualified and PPAP Capable

ï· S Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements

ï· These Devices are PbâFree, Halogen Free/BFR Free and are RoHS

Compliant*

MAXIMUM RATINGS

Rating

Symbol Value

Unit

Continuous Reverse Voltage

Peak Forward Current

Peak Forward Surge Current

200

IFM(surge)

500

Vdc

mAdc

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

Total Device Dissipation FR-5 Board

(Note 1) @TA = 25ï°C

Derate above 25ï°C

200

1.57

mW/ï°C

Thermal Resistance, JunctionâtoâAmbient RqJA

635

ï°C/W

Junction and Storage Temperature

TJ, Tstg â55 to 150 ï°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR-4 Minimum Pad.

ELECTRICAL CHARACTERISTICS (TA = 25ï°C unless otherwise noted)

Characteristic

Symbol Min Max Unit

OFF CHARACTERISTICS

Reverse Breakdown Voltage

(I(BR) = 100 mAdc)

Reverse Voltage Leakage Current

(VR = 50 Vdc)

Forward Voltage

(IF = 1.0 mAdc)

(IF = 100 mAdc)

Reverse Recovery Time

(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc)

(Figure 1)

V(BR)

trr

Vdc

70 â

mAdc

â 0.1

Vdc

0.55 0.7

0.85 1.1

â 4.0

Capacitance

(VR = 0 V)

â 2.5

http://onsemi.com

PLASTIC

SODâ323

CASE 477

STYLE 1

CATHODE

ANODE

MARKING DIAGRAM

5A M G

5A = Device Code

M = Date Code*

G = PbâFree Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending

upon manufacturing location.

ORDERING INFORMATION

Device

MMDL6050T1G

SMMDL6050T1G

Package

SODâ323

(PbâFree)

SODâ323

(PbâFree)

Shippingâ

3,000 /

Tape & Reel

3,000 /

Tape & Reel

â For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

*For additional information on our PbâFree strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

ï£ Semiconductor Components Industries, LLC, 2011

November, 2011 â Rev. 5

Publication Order Number:

MMDL6050T1/D

▷