MMDF3N06VL Datasheet, PDF (1/4 Pages) ON Semiconductor – Power MOSFET 3 Amps, 60 Volts N−Channel SO−8, Dual

MMDF3N06VL
Power MOSFET
3 Amps, 60 Volts
N−Channel SO−8, Dual
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls, these devices
are particularly well suited for bridge circuits where diode speed and
commutating safe operating areas are critical and offer additional
safety margin against unexpected voltage transients.
Features
• On−resistance Area Product about One−half that of Standard
MOSFETs with New Low Voltage, Low R_DS(on) Technology
• Faster Switching than E−FETt Predecessors
• Avalanche Energy Specified
• I_DSS and V_DS(on) Specified at Elevated Temperature
• Static Parameters are the Same for both TMOS V and TMOS E−FET
• Miniature SO−8 Surface Mount Package − Saves Board Space
• Mounting Information for SO−8 Package Provided
http://onsemi.com
V_DSS
60 V
R_DS(ON) TYP
130 mΩ
I_D MAX
3.0 A
N−Channel
D
G
S
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Gate Voltage, (R_GS = 1 MΩ)
Gate−to−Source Voltage − Continuous
Drain Current − Continuous @ T_A = 25°C
Drain Current − Continuous @ T_A = 100°C
Drain Current − Single Pulse (t_p ≤ 10 ms)
Total Power Dissipation @ T_A = 25°C
(Note 1)
V_DSS
V_DGR
V_GS
I_D
I_D
I_DM
P_D
60
Vdc
60
Vdc
± 15 Vdc
3.3
Adc
0.7
10
Apk
2.0
W
Operating and Storage Temperature Range T_J, T_stg −55 to °C
150
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = 25 Vdc, V_GS = 5.0 Vdc, Peak
I_L = 3.3 Apk, L = 10 mH, R_G = 25 Ω)
Thermal Resistance, Junction to Ambient
(Note 1)
E_AS
54
mJ
R_θJA
62.5 °C/W
Maximum Lead Temperature for Soldering
T_L
260
°C
Purposes, 0.0625″ from case for 10
seconds
1 Mounted on G10/FR4 glass epoxy board using minimum recommended
footprint.
8
1
SO−8
CASE 751
STYLE 11
MARKING
DIAGRAM
8
3N06V
ALYW
1
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
PIN ASSIGNMENT
Source−1
Gate−1
Source−2
Gate−2
18
27
36
45
Top View
Drain−1
Drain−1
Drain−2
Drain−2
ORDERING INFORMATION
Device
Package
Shipping^†
MMDF3N06VLR2 SO−8 2500 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
1
April, 2004 − Rev. 2
Publication Order Number:
MMDF3N06VL/D