MMBZ52XXBLT1G Datasheet, PDF (1/6 Pages) ON Semiconductor – Zener Voltage Regulators

MMBZ52xxBLT1G Series,
SZMMBZ52xxBLT1G Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Features
 225 mW Rating on FR−4 or FR−5 Board
 Zener Voltage Range − 2.4 V to 91 V
 Package Designed for Optimal Automated Board Assembly
 Small Package Size for High Density Applications
 ESD Rating of Class 3 (> 16 KV) per Human Body Model
 SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
 Pb−Free Packages are Available*
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MAXIMUM RATINGS
Rating
Symbol
Max
Units
Total Power Dissipation on FR−5 Board, P_D
(Note 1) @ T_A = 25C
Derated above 25C
225
mW
1.8
mW/C
Thermal Resistance,
Junction−to−Ambient
R_qJA
556
C/W
Total Power Dissipation on Alumina
Substrate, (Note 2) @ T_A = 25C
Derated above 25C
P_D
300
mW
2.4
mW/C
Thermal Resistance,
Junction−to−Ambient
R_qJA
417
C/W
Junction and Storage
Temperature Range
T_J, T_stg −65 to +150 C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 X 0.75 X 0.62 in.
2. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
SOT−23
CASE 318
STYLE 8
3
Cathode
1
Anode
MARKING DIAGRAM
xxx G
G
xxx = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MMBZ52xxBLT1G
Package
SOT−23
(Pb−Free)
Shipping^†
3,000 /
Tape & Reel
SZMMBZ52xxBLT1G SOT−23
3,000 /
(Pb−Free) Tape & Reel
MMBZ52xxBLT3G
SOT−23
(Pb−Free)
10,000 /
Tape & Reel
SZMMBZ52xxBLT3G SOT−23
(Pb−Free)
10,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
 Semiconductor Components Industries, LLC, 2012
1
February, 2012 − Rev. 11
Publication Order Number:
MMBZ5221BLT1/D