MMBT589LT1G Datasheet, PDF (1/5 Pages) ON Semiconductor – High Current Surface Mount PNP Silicon Switching

MMBT589LT1G,
NSVMMBT589LT1G
High Current Surface Mount
PNP Silicon Switching
Transistor for Load
Management in
Portable Applications
Features
• NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T_A = 25°C)
Rating
Collector −Emitter Voltage
Collector −Base Voltage
Emitter −Base Voltage
Collector Current − Continuous
Collector Current − Peak
THERMAL CHARACTERISTICS
Symbol
V_CEO
V_CBO
V_EBO
I_C
I_CM
Value
−30
−50
−5.0
−1.0
−2.0
Unit
Vdc
Vdc
Vdc
Adc
A
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1) T_A = 25°C
Derate above 25°C
Symbol
P_D
Max
310
2.5
Unit
mW
mW/°C
Thermal Resistance
Junction−to−Ambient (Note 1)
R_qJA
°C/W
403
Total Device Dissipation Alumina
Substrate, (Note 2) T_A = 25°C
Derate above 25°C
P_D
710
mW
5.7
mW/°C
Thermal Resistance
Junction−to−Ambient (Note 2)
R_qJA
°C/W
176
Total Device Dissipation (Ref. Figure 8) P_Dsingle
(Single Pulse < 10 sec.)
575
mW
Junction and Storage Temperature
T_J, T_stg −55 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR− 4 @ Minimum Pad
2. FR− 4 @ 1.0 X 1.0 inch Pad
www.onsemi.com
30 VOLTS, 2.0 AMPS
PNP TRANSISTORS
SOT−23 (TO−236)
CASE 318
STYLE 6
COLLECTOR
3
1
BASE
2
EMITTER
MARKING DIAGRAM
G3 M G
G
1
G3 = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package Shipping^†
MMBT589LT1G
NSVMMBT589LT1G
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
3,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 1998
1
October, 2016 − Rev. 7
Publication Order Number:
MMBT589LT1/D