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MMBFJ175LT1G_11 Datasheet, PDF (1/2 Pages) ON Semiconductor – JFET Chopper | |||
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MMBFJ175LT1G
JFET Chopper
PâChannel â Depletion
Features
⢠These Devices are PbâFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
DrainâGate Voltage
Reverse GateâSource Voltage
THERMAL CHARACTERISTICS
Symbol
VDG
VGS(r)
Value
25
â25
Unit
V
V
Characteristic
Total Device Dissipation FRâ5 Board,
(Note 1) TA = 25°C
Derate above 25°C
Symbol
PD
Max
225
1.8
Unit
mW
mW/°C
Thermal Resistance, JunctionâtoâAmbient RqJA
556
°C/W
Junction and Storage Temperature
TJ, Tstg â55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FRâ5 = 1.0 x 0.75 x 0.062 in.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol Min Max Unit
OFF CHARACTERISTICS
Gate âSource Breakdown Voltage
(VDS = 0, ID = 1.0 mA)
V(BR)GSS 30
â
V
Gate Reverse Current
(VDS = 0 V, VGS = 20 V)
IGSS
â 1.0 nA
Gate âSource Cutoff Voltage
(VDS = 15, ID = 10 nA)
VGS(OFF) 3.0 6.0
V
ON CHARACTERISTICS
Zero GateâVoltage Drain Current (Note 2) IDSS 7.0 60 mA
(VGS = 0, VDS = 15 V)
Drain Cutoff Current
(VDS = 15 V, VGS = 10 V)
ID(off)
â 1.0 nA
Drain Source On Resistance
(ID = 500 mA)
rDS(on)
â 125
W
Input Capacitance
Ciss
Reverse Transfer
VDS = 0, VGS = 10V
f = 1.0 MHz
Crss
Capacitance
â 11
â 5.5 pF
2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
http://onsemi.com
2 SOURCE
3
GATE
1 DRAIN
3
1
2
SOTâ23 (TOâ236)
CASE 318
STYLE 10
MARKING DIAGRAM
6W M G
G
1
6W = Device Code
M = Date Code*
G = PbâFree Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shippingâ
MMBFJ175LT1G SOTâ23 3000 / Tape & Reel
(PbâFree)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
1
August, 2009 â Rev. 5
Publication Order Number:
MMBFJ175LT1/D
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