MMBF2201N Datasheet, PDF (1/4 Pages) ON Semiconductor – Power MOSFET 300 mAmps, 20 Volts

MMBF2201N, NVF2201N
Power MOSFET
300 mAmps, 20 Volts
N−Channel SC−70/SOT−323
These miniature surface mount MOSFETs low R_DS(on) assure
minimal power loss and conserve energy, making these devices ideal
for use in small power management circuitry. Typical applications are
dc−dc converters, power management in portable and
battery−powered products such as computers, printers, PCMCIA
cards, cellular and cordless telephones.
Features
• Low R_DS(on) Provides Higher Efficiency and Extends Battery Life
• Miniature SC−70/SOT−323 Surface Mount Package Saves
Board Space
• NVF Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable*
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value
Drain−to−Source Voltage
V_DSS
20
Gate−to−Source Voltage − Continuous
V_GS
± 20
Drain Current
− Continuous @ T_A = 25°C
− Continuous @ T_A = 70°C
− Pulsed Drain Current (t_p ≤ 10 ms)
I_D
300
I_D
240
I_DM
750
Total Power Dissipation @ T_A = 25°C
(Note 1)
Derate above 25°C
P_D
150
1.2
Unit
Vdc
Vdc
mAdc
mW
mW/°C
Operating and Storage Temperature Range
Thermal Resistance, Junction−to−Ambient
Maximum Lead Temperature for Soldering
Purposes, for 10 seconds
T_J, T_stg
R_qJA
T_L
− 55 to 150
833
260
°C
°C/W
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Mounted on G10/FR4 glass epoxy board using minimum recommended
footprint.
http://onsemi.com
300 mAMPS, 20 VOLTS
R_DS(on) = 1 W
N−Channel
3
1
2
1
2
MARKING DIAGRAM
AND PIN ASSIGNMENT
3
3
Drain
SC−70/SOT−323
CASE 419
STYLE 8
N1 M G
G
1
2
Gate Source
N1 = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
MMBF2201NT1G SOT−323
(Pb−Free)
3000 / Tape &
Reel
NVF2201NT1G*
SOT−323
(Pb−Free)
3000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
1
August, 2013 − Rev. 7
Publication Order Number:
MMBF2201NT1/D