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MMBF0201NLT1_06 Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET 300 mAmps, 20 Volts N−Channel SOT−23
MMBF0201NLT1
Preferred Device
Power MOSFET
300 mAmps, 20 Volts
N−Channel SOT−23
These miniature surface mount MOSFETs low RDS(on) assure
minimal power loss and conserve energy, making these devices ideal
for use in small power management circuitry. Typical applications are
dc−dc converters, power management in portable and
battery−powered products such as computers, printers, PCMCIA
cards, cellular and cordless telephones.
Features
• Low RDS(on) Provides Higher Efficiency and Extends Battery Life
• Miniature SOT−23 Surface Mount Package Saves Board Space
• Pb−Free Package is Available
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Drain Current
− Continuous @ TA = 25°C
− Continuous @ TA = 70°C
− Pulsed Drain Current (tp ≤ 10 ms)
Total Power Dissipation @ TA = 25°C
Operating and Storage Temperature Range
Thermal Resistance, Junction−to−Ambient
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
VDSS
VGS
ID
ID
IDM
PD
TJ, Tstg
RqJA
TL
20
± 20
300
240
750
225
− 55 to 150
556
260
Vdc
Vdc
mAdc
mW
°C
°C/W
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
http://onsemi.com
300 mAMPS − 20 VOLTS
RDS(on) = 1 W
N−Channel
3
1
2
MARKING DIAGRAM
AND PIN ASSIGNMENT
3
3
Drain
1
2
SOT−23
CASE 318
STYLE 21
N1 M G
G
1
2
Gate Source
N1
= Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
MMBF0201NLT1 SOT−23 3000 Tape & Reel
MMBF0201NLT1G SOT−23 3000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
1
January, 2006 − Rev. 3
Publication Order Number:
MMBF0201NLT1/D