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| MMBD6050LT1G Datasheet, PDF (1/3 Pages) ON Semiconductor – Switching Diode | |||
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MMBD6050LT1G
Switching Diode
Features
⢠These Devices are PbâFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current
Peak Forward Surge Current
THERMAL CHARACTERISTICS
Symbol
VR
IF
IFM(surge)
Value
70
200
500
Unit
Vdc
mAdc
mAdc
Characteristic
Total Device Dissipation FRâ5 Board,
(Note 1) TA = 25°C
Derate above 25°C
Symbol
PD
Max
Unit
225
mW
1.8
mW/°C
Thermal Resistance, JunctionâtoâAmbient
Total Device Dissipation Alumina
Substrate, (Note 2) TA = 25°C
Derate above 25°C
RqJA
PD
556
°C/W
300
mW
2.4
mW/°C
Thermal Resistance, JunctionâtoâAmbient RqJA
417
°C/W
Junction and Storage Temperature
TJ, Tstg â55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FRâ5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Rating
Symbol Min Max Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I(BR) = 100 mAdc)
VR
70 â Vdc
Reverse Voltage Leakage Current
(VR = 50 Vdc)
IF
â 0.1 mAdc
Forward Voltage
(IF = 1.0 mAdc)
(IF = 100 mAdc)
IFM(surge)
Vdc
0.55 0.7
0.85 1.1
Reverse Recovery Time (Figure 1)
IF
(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc)
â 4.0 ns
Capacitance
(VR = 0 V)
IFM(surge) â 2.5
pF
http://onsemi.com
3
CATHODE
1
ANODE
3
1
2
SOTâ23 (TOâ236)
CASE 318
STYLE 8
MARKING DIAGRAM
5A M G
G
1
5A = Device Code
M = Date Code*
G = PbâFree Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shippingâ
MMBD6050LT1G SOTâ23 3,000 / Tape & Reel
(PbâFree)
MMBD6050LT3G SOTâ23 10,000/Tape & Reel
(PbâFree)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
1
August, 2009 â Rev. 5
Publication Order Number:
MMBD6050LT1/D
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